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ꢀꢉ ꢁꢈ ꢄ ꢊ ꢋ ꢌꢉꢁ ꢍꢎꢏ ꢍꢐ ꢀꢉ ꢏ ꢉꢅꢊ ꢌꢑ ꢁꢒ ꢈ ꢑꢏꢊ
SCES487B − SEPTEMBER 2003 − REVISED FEBRUARY 2004
DBV OR DCK PACKAGE
(TOP VIEW)
D
Available in the Texas Instruments
NanoStar and NanoFree Packages
D
D
D
D
D
D
D
D
Supports 5-V V
Operation
CC
1
2
3
6
5
4
A
GND
B
C
Inputs Accept Voltages to 5.5 V
V
Y
CC
Max t of 4.1 ns at 3.3 V
pd
Low Power Consumption, 10-µA Max I
CC
24-mA Output Drive at 3.3 V
YEP OR YZP PACKAGE
(BOTTOM VIEW)
I
Supports Partial-Power-Down Mode
off
Operation
3 4
2 5
1 6
B
GND
A
Y
V
C
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
CC
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
Y + A • B • C or Y + A ) B ) C
The SN74LVC1G11 performs the Boolean function
in positive logic.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs,
off
off
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
‡
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
SN74LVC1G11YEPR
Tape and reel
_ _ _C3_
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SN74LVC1G11YZPR
−40°C to 85°C
SOT (SOT-23) − DBV
Tape and reel SN74LVC1G11DBVR
Tape and reel SN74LVC1G11DCKR
C11_
C3_
SOT (SC-70) − DCK
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin
1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
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Copyright 2004, Texas Instruments Incorporated
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1
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