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SN74LVC1G11DBVR PDF预览

SN74LVC1G11DBVR

更新时间： 2024-02-06 09:02:42
品牌 Logo 应用领域
德州仪器 - TI 输入元件
页数 文件大小 规格书
11页 252K
描述
SINGLE 3 INPUT POSITIVE AND GATE

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SN74LVC1G11DBVR 数据手册

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SCES487B − SEPTEMBER 2003 − REVISED FEBRUARY 2004  
DBV OR DCK PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
D
D
D
D
D
Supports 5-V V  
Operation  
CC  
1
2
3
6
5
4
A
GND  
B
C
Inputs Accept Voltages to 5.5 V  
V
Y
CC  
Max t of 4.1 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
CC  
24-mA Output Drive at 3.3 V  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
I
Supports Partial-Power-Down Mode  
off  
Operation  
3 4  
2 5  
1 6  
B
GND  
A
Y
V
C
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
CC  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
Y + A • B • C or Y + A ) B ) C  
The SN74LVC1G11 performs the Boolean function  
in positive logic.  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs,  
off  
off  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
T
A
PACKAGE  
‡
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
SN74LVC1G11YEPR  
Tape and reel  
_ _ _C3_  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
SN74LVC1G11YZPR  
−40°C to 85°C  
SOT (SOT-23) − DBV  
Tape and reel SN74LVC1G11DBVR  
Tape and reel SN74LVC1G11DCKR  
C11_  
C3_  
SOT (SC-70) − DCK  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin  
1 identifier indicates solder-bump composition  
(1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
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Copyright 2004, Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...11

中文翻译

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SN74LVC1G11DBVR 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVC1G11DCKR TI

完全替代

 SINGLE 3 INPUT POSITIVE AND GATE
SN74LVC1G11DBVRG4 TI

类似代替

 SINGLE 3-INPUT POSITIVE-AND GATE
SN74LVC1G11DCKRG4 TI

类似代替

 SINGLE 3-INPUT POSITIVE-AND GATE

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SN74LVC1G11DCKRE4 TI

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SN74LVC1G11DCKRG4 TI

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 		SINGLE 3-INPUT POSITIVE-AND GATE
SN74LVC1G11DRY TI

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 		AND Gate
SN74LVC1G11DRYR TI

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 		Single 3-Input Positive-AND Gate 6-SON -40 to 125
SN74LVC1G11DSFR TI

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