ꢀꢁ ꢂꢃ ꢄꢅ ꢂꢃ ꢆꢇ ꢈ ꢉ
ꢊꢋꢆ ꢄ ꢌꢍ ꢀꢎ ꢏ ꢎꢅꢐ ꢇꢐꢊꢑ ꢐꢇꢏ ꢒꢎ ꢑ ꢑꢐ ꢒꢐꢊ ꢊꢇꢏ ꢓꢌ ꢐ ꢔꢄ ꢎꢌ ꢇ ꢔꢄꢍ ꢌ
SCLS556A − DECEMBER 2003 − REVISED MAY 2004
D OR PW PACKAGE
(TOP VIEW)
D
Qualification in Accordance With
AEC-Q100
†
D
Qualified for Automotive Applications
1
2
3
4
5
6
7
14
13
12
11
10
9
1CLR
1D
V
CC
2CLR
2D
D
Customer-Specific Configuration Control
Can Be Supported Along With
Major-Change Approval
1CLK
1PRE
1Q
2CLK
2PRE
2Q
D
D
D
2-V to 5.5-V V
Operation
CC
1Q
Max t of 13 ns at 5 V
pd
8
GND
2Q
Typical V
<0.8 V at V
(Output Ground Bounce)
OLP
CC
= 3.3 V, T = 25°C
A
D
D
D
D
D
Typical V
>2.3 V at V
(Output V
Undershoot)
OHV
CC
OH
= 3.3 V, T = 25°C
A
Support Mixed-Mode Voltage Operation on
All Ports
I
Supports Partial-Power-Down Mode
off
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
†
Contact factory for details. Q100 qualification data available on
request.
description/ordering informationS
This dual positive-edge-triggered D-type flip-flop is designed for 2-V to 5.5-V V
operation.
CC
A low level at the preset (PRE) or clear (CLR) inputs sets or resets the outputs, regardless of the levels of the
other inputs. When PRE and CLR are inactive (high), data at the data (D) inputs meeting the setup-time
requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs
at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval,
data at the D input can be changed without affecting the levels at the outputs.
This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs,
off
off
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
PACKAGE
T
A
SOIC − D
Tape and reel SN74LV74AQDRQ1
Tape and reel SN74LV74AQPWRQ1
LV74A
LV74A
−40°C to 125°C
TSSOP − PW
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢌ
ꢒ
ꢍ
ꢊ
ꢋ
ꢕ
ꢏ
ꢎ
ꢍ
ꢁ
ꢊ
ꢆ
ꢏ
ꢆ
ꢖ
ꢗ
ꢘ
ꢙ
ꢚ
ꢛ
ꢜ
ꢝ
ꢖ
ꢙ
ꢗ
ꢖ
ꢞ
ꢟ
ꢠ
ꢚ
ꢚ
ꢡ
ꢗ
ꢝ
ꢜ
ꢞ
ꢙ
ꢘ
ꢢ
ꢠ
ꢣ
ꢤ
ꢖ
ꢟ
ꢜ
ꢝ
ꢖ
ꢙ
ꢗ
ꢥ
ꢜ
ꢝ
ꢡ
ꢦ
Copyright 2004, Texas Instruments Incorporated
ꢌꢚ ꢙ ꢥꢠꢟ ꢝ ꢞ ꢟ ꢙꢗ ꢘꢙ ꢚ ꢛ ꢝ ꢙ ꢞ ꢢꢡ ꢟ ꢖꢘ ꢖꢟꢜ ꢝꢖ ꢙꢗꢞ ꢢꢡ ꢚ ꢝꢧ ꢡ ꢝꢡ ꢚ ꢛꢞ ꢙꢘ ꢏꢡꢨ ꢜꢞ ꢎꢗꢞ ꢝꢚ ꢠꢛ ꢡꢗꢝ ꢞ
ꢞ ꢝ ꢜ ꢗꢥ ꢜ ꢚꢥ ꢩ ꢜ ꢚꢚ ꢜ ꢗ ꢝꢪꢦ ꢌꢚ ꢙ ꢥꢠꢟ ꢝꢖꢙꢗ ꢢꢚ ꢙꢟ ꢡꢞ ꢞꢖ ꢗꢫ ꢥꢙꢡ ꢞ ꢗꢙꢝ ꢗꢡ ꢟꢡ ꢞꢞ ꢜꢚ ꢖꢤ ꢪ ꢖꢗꢟ ꢤꢠꢥ ꢡ
ꢝ ꢡ ꢞ ꢝꢖ ꢗꢫ ꢙꢘ ꢜ ꢤꢤ ꢢꢜ ꢚ ꢜ ꢛ ꢡ ꢝ ꢡ ꢚ ꢞ ꢦ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265