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SMMBT5088LT1G PDF预览

SMMBT5088LT1G

更新时间: 2024-11-21 01:17:27
品牌 Logo 应用领域
安森美 - ONSEMI 光电二极管晶体管
页数 文件大小 规格书
5页 188K
描述
Low Noise Transistors

SMMBT5088LT1G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
Factory Lead Time:4 weeks风险等级:5.68
最大集电极电流 (IC):0.05 A集电极-发射极最大电压:30 V
配置:SINGLE最小直流电流增益 (hFE):300
JEDEC-95代码:TO-236ABJESD-30 代码:R-PDSO-G3
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:NPN
最大功率耗散 (Abs):0.3 W参考标准:AEC-Q101
子类别:Other Transistors表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管元件材料:SILICON标称过渡频率 (fT):50 MHz
Base Number Matches:1

SMMBT5088LT1G 数据手册

 浏览型号SMMBT5088LT1G的Datasheet PDF文件第2页浏览型号SMMBT5088LT1G的Datasheet PDF文件第3页浏览型号SMMBT5088LT1G的Datasheet PDF文件第4页浏览型号SMMBT5088LT1G的Datasheet PDF文件第5页 
MMBT5088L, MMBT5089L  
Low Noise Transistors  
NPN Silicon  
Features  
S and NSV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable  
www.onsemi.com  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
SOT−23 (TO−236)  
CASE 318  
MAXIMUM RATINGS  
STYLE 6  
Rating  
Symbol  
Value  
Unit  
COLLECTOR  
3
CollectorEmitter Voltage  
MMBT5088L  
V
CEO  
V
CBO  
V
EBO  
Vdc  
30  
25  
MMBT5089L  
1
BASE  
CollectorBase Voltage  
MMBT5088L  
Vdc  
35  
30  
MMBT5089L  
2
EMITTER  
EmitterBase Voltage  
4.5  
50  
Vdc  
Collector Current − Continuous  
I
C
mAdc  
MARKING DIAGRAM  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
1x M G  
Total Device Dissipation FR−5 Board,  
P
D
G
(Note 1) T = 25°C  
225  
1.8  
mW  
mW/°C  
A
Derate above 25°C  
1
Thermal Resistance, Junction−to−Ambient  
R
556  
°C/W  
q
JA  
1x = Device Code  
x = Q for MMBT5088L  
SMMBT5088L  
Total Device Dissipation Alumina  
P
D
Substrate, (Note 2) T = 25°C  
300  
2.4  
mW  
mW/°C  
A
x = R for MMBT5089L  
SMMBT5089L  
Derate above 25°C  
Thermal Resistance, Junction−to−Ambient  
Junction and Storage Temperature  
R
417  
°C/W  
°C  
q
JA  
M
= Date Code*  
G
= Pb−Free Package  
T , T  
J
−55 to +150  
stg  
(Note: Microdot may be in either location)  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. FR−5 = 1.0 x 0.75 x 0.062 in.  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MMBT5088LT1G,  
SMMBT5088LT1G  
SOT−23  
(Pb−Free)  
3,000 / Tape &  
Reel  
NSVMMBT5088LT3G SOT−23 10,000 / Tape &  
(Pb−Free)  
Reel  
MMBT5089LT1G,  
SMMBT5089LT1G  
SOT−23  
(Pb−Free)  
3,000 / Tape &  
Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 1994  
1
Publication Order Number:  
October, 2016 − Rev. 6  
MMBT5088LT1/D  
 

SMMBT5088LT1G 替代型号

型号 品牌 替代类型 描述 数据表
MMBT5088LT1G ONSEMI

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