Datasheet > SiZ342DT

SiZ342DT

更新时间： 2024-10-01 14:50:15

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
10页	321K
描述
Dual N-Channel 30 V (D-S) MOSFETs

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SiZ342DT 数据手册

SiZ342DT

Vishay Siliconix

www.vishay.com

Dual N-Channel 30 V (D-S) MOSFET

FEATURES

• PowerPAIR^®optimizes high-side and low-side

MOSFETs for synchronous buck converters

• TrenchFET^®Gen IV power MOSFETs

• 100 % R_gand UIS tested

PRODUCT SUMMARY

V_DS(V)

R_DS(on)(Ω) MAX.

I_D(A) Q_g(Typ.)

Channel-1

and

Channel-2

0.0115 at V_GS= 10 V

30 ^a

4.5 nC

0.0153 at V_GS= 4.5 V

27.5

• Material categorization: for definitions of

compliance please see www.vishay.com/doc?99912

PowerPAIR^®3 x 3

G₂

S₂

APPLICATIONS

S₂

• Synchronous buck

- Battery charging

S₁/D₂

(Pin 9)

D₁

- Computer system power

- Graphic cards

G₁

D₁

• POL

N-Channel 1

MOSFET

D₁

S /D

D₁

Top View

Bottom View

Ordering Information:

SiZ342DT-T1-GE3 (lead (Pb)-free and halogen-free)

N-Channel 2

MOSFET

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

CHANNEL-1 AND CHANNEL-2

PARAMETER

SYMBOL

V_DS

LIMIT

UNIT

Drain-Source Voltage

Gate-Source Voltage

V_GS

+20 / -16

30 ^a

_C= 25 °C

_C= 70 °C

26.5

Continuous Drain Current (T_J= 150 °C)

I_D

T_A= 25 °C

T_A= 70 °C

15.6 ^{b, c}

12.4 ^{b, c}

100

Pulsed Drain Current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

13.9

3.1 ^{b, c}

Continuous Source Drain Diode Current

T_A= 25 °C

Avalanche Current

I_AS

L = 0.1 mH

Single Pulse Avalanche Energy

E_AS

_C= 25 °C

_C= 70 °C

16.7

10.7

Maximum Power Dissipation

P_D

T_A= 25 °C

T_A= 70 °C

3.7 ^{b, c}

2.4 ^{b, c}

-55 to 150

260

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature) ^{d, e}

T_J, T_stg

°C

Notes

a. Package limited.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 10 s.

d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR 3 x 3 is a leadless package. The end of the lead terminal is exposed copper

(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not

required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

S15-0031-Rev. B, 19-Jan-15

Document Number: 62949

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...10

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