Datasheet > SISA18DN

SISA18DN

更新时间： 2024-11-19 01:18:59

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
13页	582K
描述
N-Channel 30 V (D-S) MOSFET

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SiSA18DN

Vishay Siliconix

N-Channel 30 V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

•

TrenchFET^®Gen IV Power MOSFET

V_DS(V)

R_DS(on)() (Max.)

0.0075 at V_GS= 10 V

0.0120 at V_GS= 4.5 V

I_D(A)^f

38.3

Q_g(Typ.)

100 % R_gand UIS Tested

Material categorization:

6.9 nC

30.2

For definitions of compliance please see

www.vishay.com/doc?99912

PowerPAK^®1212-8

APPLICATIONS

•

DC/DC Power Supplies

3.30 mm

High Current Power Rails in Computing

Telecom POL and Bricks

Battery Protection

N-Channel MOSFET

Bottom View

Ordering Information:

SiSA18DN-T1-GE3 (Lead (Pb)-free and Halogen-free)

ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)

Parameter

Symbol

Limit

Unit

V_DS

Drain-Source Voltage

Gate-Source Voltage

V_GS

+ 20, - 16

38.3

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

30.6

I_D

Continuous Drain Current (T_J= 150 °C)

15.3^{a, b}

12.1^{a, b}

I_DM

I_S

Pulsed Drain Current (t = 300 µs)

T_C= 25 °C

T_A= 25 °C

2.9^{a, b}

Continuous Source-Drain Diode Current

I_AS

Single Pulse Avalanche Current

Single Pulse Avalanche Energy

L = 0.1 mH

E_AS

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

19.8

12.7

P_D

Maximum Power Dissipation

3.2^{a, b}

3^{a, b}

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)^{c, d}

T_J, T_stg

- 55 to 150

260

°C

THERMAL RESISTANCE RATINGS

Parameter

Symbol

Typical

Maximum

Unit

Maximum Junction-to-Ambient^{a, e}

Maximum Junction-to-Case (Drain)

t  10 s

Steady State

R_thJA

R_thJC

°C/W

6.3

Notes:

a. Surface mounted on 1" x 1" FR4 board.

b. t = 10 s.

c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and

is not required to ensure adequate bottom side solder interconnection.

d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

e. Maximum under steady state conditions is 81 °C/W.

f. Based on T_C= 25 °C.

Document Number: 62579

S12-2051-Rev. A, 27-Aug-12

www.vishay.com

For technical questions, contact: pmostechsupport@vishay.com

This document is subject to change without notice.

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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