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SISB46DN

更新时间： 2024-11-19 01:18:59
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威世 - VISHAY /
页数 文件大小 规格书
13页 601K
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Dual N-Channel 40 V (D-S) MOSFET

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SISB46DN 数据手册

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SiSB46DN  
Vishay Siliconix  
www.vishay.com  
Dual N-Channel 40 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
• TrenchFET® Gen IV power MOSFET  
• Tuned for the lowest RDS - Qoss FOM  
• 100 % Rg and UIS tested  
VDS (V)  
RDS(on) () MAX.  
0.01171 at VGS = 10 V  
0.01580 at VGS = 4.5 V  
ID (A) f  
34  
Qg (TYP.)  
40  
6.8 nC  
29.4  
• Qgd / Qgs ratio < 1 optimizes switching characteristics  
• Material categorization:  
PowerPAK® 1212-8 Dual  
for definitions of compliance please see  
www.vishay.com/doc?99912  
D1  
D1  
7
8
D2  
6
APPLICATIONS  
D2  
5
• Synchronous rectification  
• DC/DC converters  
• Motor drive switch  
• Battery and load switch  
1
S1  
D
D
2
2
G1  
1
3
S2  
4
G
2  
1
Top View  
Bottom View  
G
G
2
1
Ordering Information:  
SiSB46DN-T1-GE3 (lead (Pb)-free and halogen-free)  
S
S
2
1
N-Channel MOSFET  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
40  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
+20 / -16  
34  
TC = 25 °C  
C = 70 °C  
T
27.3  
Continuous Drain Current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
11.4 a, b  
9.2 a, b  
70  
A
Pulsed Drain Current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
19  
2.2 a, b  
Continuous Source-Drain Diode Current  
TA = 25 °C  
L = 0.1 mH  
TC = 25 °C  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
IAS  
11  
EAS  
6
mJ  
W
23  
TC = 70 °C  
14.8  
Maximum Power Dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
2.6 a, b  
1.7 a, b  
-55 to +150  
260  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak temperature) c, d  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum Junction-to-Ambient a, e  
SYMBOL  
RthJA  
TYPICAL  
38  
MAXIMUM  
UNIT  
t 10 s  
Steady state  
48  
°C/W  
Maximum Junction-to-Case (Drain)  
RthJC  
4.3  
5.4  
Notes  
a. Surface mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
e. Maximum under steady state conditions is 94 °C/W.  
f. Based on TC = 25 °C.  
S16-1524-Rev. A, 08-Aug-16  
Document Number: 76655  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
1234567...13

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