SiSF04DN
Vishay Siliconix
www.vishay.com
Common Drain Dual N-Channel 30 V (S1-S2) MOSFET
FEATURES
• TrenchFET® Gen IV power MOSFET
PowerPAK® 1212-8SCD
S1
8
S1
7
• Very low source-to-source on resistance
S2
6
S2
5
• Integrated common-drain n-channel MOSFETs
in a compact and thermally enhanced package
S1
S2
• 100 % Rg and UIS tested
• Optimizes circuit layout for bi-directional current flow
1
G1
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
2
D1
3
D2
4
G2
APPLICATIONS
S1
Top View
Bottom View
• Battery protection switch
PRODUCT SUMMARY
VS1S2 (V)
RS1S2(on) max. () at VGS = 10 V
G1
• Bi-directional switch
30
N-Channel 1 MOSFET
• Load switch
0.0040
0.0060
19
N-Channel 2 MOSFET
G2
R
S1S2(on) max. () at VGS = 4.5 V
Qg typ. (nC) g
S1S2 (A) a
Configuration
I
108
S2
Common drain
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK 1212-8SCD
SiSF04DN-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
30
+16 / -12
108
UNIT
Drain-source voltage
Gate-source voltage
VS1S2
VGS
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
86
Continuous drain current (TJ = 150 °C)
Pulsed drain current (t = 100 μs)
Maximum power dissipation
IS1S2
IS1S2M
PD
30 b, c
24 b, c
190
A
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
69.4
44.4
5.2 b, c
3.3 b, c
-55 to +150
260
W
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b
SYMBOL
RthJA
RthJC
TYPICAL
19
MAXIMUM
UNIT
t 10 s
Steady state
24
1.8
°C/W
Maximum junction-to-case (drain)
1.4
Notes
a. TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8SCD is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 63 °C/W
g. Single MOSFET
S19-0764-Rev. A, 02-Sep-2019
Document Number: 77230
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000