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SiSH129DN PDF预览

SiSH129DN

更新时间: 2024-11-22 14:56:03
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 194K
描述
P-Channel 30 V (D-S) MOSFET

SiSH129DN 数据手册

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SiSH129DN  
Vishay Siliconix  
www.vishay.com  
P-Channel 30 V (D-S) MOSFET  
FEATURES  
• TrenchFET® power MOSFET  
• Low thermal resistance PowerPAK® package  
with small size  
PowerPAK® 1212-8SH  
D
8
D
D
7
D
5
6
• 100 % Rg and UIS tested  
• Material categorization: for definitions of  
compliance please see www.vishay.com/doc?99912  
0.9 mm  
1
S
2
S
3
S
4
G
1
S
APPLICATIONS  
Top View  
Bottom View  
• Load switch  
• Adapter switch  
G
PRODUCT SUMMARY  
• Notebook PC  
VDS (V)  
-30  
0.0114  
0.0200  
24.6  
R
DS(on) max. () at VGS = -10 V  
DS(on) max. () at VGS = -4.5 V  
R
Qg typ. (nC)  
D
e, f  
ID (A)  
-35  
P-Channel MOSFET  
Configuration  
Single  
ORDERING INFORMATION  
Package  
PowerPAK 1212-8  
Lead (Pb)-free and halogen-free  
SiSH129DN-T1-GE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
-30  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
20  
T
T
C = 25 °C  
C = 70 °C  
-35 e  
-35 e  
-14.4 a, b  
-11.5 a, b  
-60  
Continuous drain current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
Pulsed drain current  
IDM  
IS  
T
C = 25 °C  
-35 e  
-3.2 a, b  
Continuous source-drain diode current  
TA = 25 °C  
Avalanche current  
IAS  
-25  
L = 0.1 mH  
Single pulse avalanche energy  
EAS  
31.25  
52.1  
mJ  
W
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
3.3  
Maximum power dissipation  
PD  
3.8 a, b  
2.4 a, b  
-50 to +150  
260  
TA = 70 °C  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) c, d  
TJ, Tstg  
°C  
Notes  
a. Surface mounted on 1" x 1" FR4 board  
b. t = 10 s  
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8SH is a leadless package within the PowerPAK 1212-8 package  
family. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at  
the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection  
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
e. Package limited  
f. Based on TC = 25 °C  
S18-0696-Rev.B, 09-Jul-2018  
Document Number: 75903  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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