Datasheet > SiSH129DN

SiSH129DN

更新时间： 2024-11-06 14:56:03

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	194K
描述
P-Channel 30 V (D-S) MOSFET

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SiSH129DN 数据手册

SiSH129DN

Vishay Siliconix

www.vishay.com

P-Channel 30 V (D-S) MOSFET

FEATURES

• TrenchFET^®power MOSFET

• Low thermal resistance PowerPAK^®package

with small size

PowerPAK^®1212-8SH

• 100 % R_gand UIS tested

• Material categorization: for definitions of

compliance please see www.vishay.com/doc?99912

0.9 mm

APPLICATIONS

Top View

Bottom View

• Load switch

• Adapter switch

PRODUCT SUMMARY

• Notebook PC

V_DS(V)

-30

0.0114

0.0200

24.6

_DS(on)max. () at V_GS= -10 V

_DS(on)max. () at V_GS= -4.5 V

Q_gtyp. (nC)

e, f

I_D(A)

-35

P-Channel MOSFET

Configuration

Single

ORDERING INFORMATION

Package

PowerPAK 1212-8

Lead (Pb)-free and halogen-free

SiSH129DN-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

-30

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

_C= 25 °C

_C= 70 °C

-35 ^e

-14.4 ^{a, b}

-11.5 ^{a, b}

-60

Continuous drain current (T_J= 150 °C)

I_D

T_A= 25 °C

T_A= 70 °C

Pulsed drain current

I_DM

I_S

_C= 25 °C

-35 ^e

-3.2 ^{a, b}

Continuous source-drain diode current

T_A= 25 °C

Avalanche current

I_AS

-25

L = 0.1 mH

Single pulse avalanche energy

E_AS

31.25

52.1

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

3.3

Maximum power dissipation

P_D

3.8 ^{a, b}

2.4 ^{a, b}

-50 to +150

260

T_A= 70 °C

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^{c, d}

T_J, T_stg

°C

Notes

a. Surface mounted on 1" x 1" FR4 board

b. t = 10 s

c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8SH is a leadless package within the PowerPAK 1212-8 package

family. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at

the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection

d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

e. Package limited

f. Based on T_C= 25 °C

S18-0696-Rev.B, 09-Jul-2018

Document Number: 75903

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...9

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