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SiSH106DN

更新时间： 2024-11-19 14:53:59
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 184K
描述
N-Channel 20 V (D-S) Fast Switching MOSFET

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SiSH106DN  
Vishay Siliconix  
www.vishay.com  
N-Channel 20 V (D-S) Fast Switching MOSFET  
FEATURES  
• TrenchFET® power MOSFET  
PowerPAK® 1212-8SH  
D
8
D
7
D
6
• 2.5 V rated RDS(on)  
• PWM optimized  
• 100 % Rg tested  
D
5
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
0.9 mm  
1
S
2
S
3
S
4
G
1
D
APPLICATIONS  
Top View  
Bottom View  
• Synchronous rectification  
• Load switch  
PRODUCT SUMMARY  
VDS (V)  
G
20  
R
DS(on) max. () at VGS = 4.5 V  
DS(on) max. () at VGS = 2.5 V  
0.0062  
0.0098  
17.5  
R
S
Qg typ. (nC)  
D (A)  
Configuration  
N-Channel MOSFET  
I
19.5  
Single  
ORDERING INFORMATION  
Package  
PowerPAK 1212-8  
Lead (Pb)-free and halogen-free  
SiSH106DN-T1-GE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
10 s  
20  
STEADYSTATE  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
20  
12  
V
VGS  
12  
TA = 25 °C  
TA = 70 °C  
19.5  
15.6  
60  
12.5  
10  
Continuous drain current (TJ = 150 °C) a  
ID  
Pulsed drain current  
Continuous source current (diode conduction) a  
IDM  
IS  
60  
A
3.2  
30  
1.3  
30  
Single avalanche current  
IAS  
EAS  
L = 0.1 mH  
Single avalanche energy  
45  
45  
mJ  
W
TA = 25 °C  
TA = 70 °C  
3.8  
2
1.5  
0.8  
Maximum power dissipation a  
PD  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) b, c  
TJ, Tstg  
-55 to +150  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
RthJA  
TYPICAL  
MAXIMUM  
UNIT  
t 10 s  
24  
65  
33  
81  
Maximum junction-to-ambient a  
Maximum junction-to-case (drain)  
Steady state  
Steady state  
°C/W  
RthJC  
1.9  
2.4  
Notes  
a. Surface mounted on 1" x 1" FR4 board  
b. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8SH is a leadless package within the PowerPAK 1212-8 package  
family. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at  
the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection  
c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
S18-0684-Rev. A, 09-Jul-2018  
Document Number: 79358  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
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