Datasheet > SiSH617DN

SiSH617DN

更新时间： 2024-11-06 14:55:55

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	185K
描述
P-Channel 30 V (D-S) MOSFET

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SiSH617DN 数据手册

SiSH617DN

Vishay Siliconix

www.vishay.com

P-Channel 30 V (D-S) MOSFET

FEATURES

PowerPAK^®1212-8SH

• TrenchFET^®power MOSFET

• 100 % R_gand UIS tested

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

0.9 mm

APPLICATIONS

• Notebook battery charging

Top View

Bottom View

• Notebook adapter switch

PRODUCT SUMMARY

V_DS(V)

-30

0.0123

0.0222

20.5

R_DS(on)max. () at V_GS= -10 V

R_DS(on)max. () at V_GS= -4.5 V

Q_gtyp. (nC)

_D(A) ^{d, g}

-35

P-Channel MOSFET

Configuration

Single

ORDERING INFORMATION

Package

PowerPAK 1212-8

Lead (Pb)-free and halogen-free

SiSH617DN-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

-30

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

_C= 25 °C

-35 ^d

-13.9 ^{a, b}

-11.1 ^{a, b}

-60

-35 ^d

-3 ^{a, b}

-29

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Continuous drain current (T_J= 150 °C)

I_D

Pulsed drain current

I_DM

I_S

T_C= 25 °C

Continuous source-drain diode current

T_A= 25 °C

L = 0.1 mH

T_C= 25 °C

Avalanche current

I_AS

Single-pulse avalanche energy

E_AS

_C= 70 °C

Maximum power dissipation

P_D

T_A= 25 °C

T_A= 70 °C

3.7 ^{a, b}

2.4 ^{a, b}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^{e, f}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^{a, c}

SYMBOL

R_thJA

TYPICAL

MAXIMUM

UNIT

t  10 s

Steady state

°C/W

Maximum junction-to-case

R_thJC

1.9

2.4

Notes

a. Surface mounted on 1" x 1" FR4 board

b. t = 10 s

c. Maximum under steady state conditions is 81 °C/W

d. Package limited

e. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8SH is a leadless package within the PowerPAK 1212-8 package

family. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at

the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection

f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

g. Based on T_C= 25 °C

S18-0699-Rev.B, 09-Jul-2018

Document Number: 75900

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...9

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