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SiSH410DN PDF预览

SiSH410DN

更新时间: 2024-11-06 14:54:39
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 189K
描述
N-Channel 20 V (D-S) MOSFET

SiSH410DN 数据手册

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SiSH410DN  
Vishay Siliconix  
www.vishay.com  
N-Channel 20 V (D-S) MOSFET  
FEATURES  
PowerPAK® 1212-8SH  
D
8
• TrenchFET® power MOSFET  
• 100 % Rg and UIS tested  
• Material categorization:  
D
D
6
7
D
5
for definitions of compliance please see  
www.vishay.com/doc?99912  
0.9 mm  
1
S
2
S
3
S
D
APPLICATIONS  
4
G
1
• DC/DC converter  
- Notebook  
- POL  
Top View  
Bottom View  
PRODUCT SUMMARY  
G
VDS (V)  
20  
R
DS(on) max. () at VGS = 10 V  
DS(on) max. () at VGS = 4.5 V  
0.0048  
0.0063  
16.7  
R
S
N-Channel MOSFET  
Qg typ. (nC)  
D (A) a  
Configuration  
I
35  
Single  
ORDERING INFORMATION  
Package  
PowerPAK 1212-8  
Lead (Pb)-free and halogen-free  
SiSH410DN-T1-GE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
20  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
VGS  
V
20  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
35 a  
35 a  
Continuous drain current (TJ = 150 °C)  
ID  
22 b, c  
17.8 b, c  
60  
A
Pulsed drain current  
Avalanche current  
Avalanche energy  
IDM  
IAS  
EAS  
35  
61  
43  
3.2 b, c  
52  
L = 0.1 mH  
mJ  
A
T
C = 25 °C  
Continuous source-drain diode current  
IS  
TA = 25 °C  
TC = 25 °C  
T
C = 70 °C  
33  
Maximum power dissipation  
PD  
W
TA = 25 °C  
TA = 70 °C  
3.8 b, c  
2.4 b, c  
-55 to +150  
260  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum junction-to-ambient b, f  
SYMBOL  
RthJA  
RthJC  
TYPICAL  
24  
MAXIMUM  
UNIT  
t 10 s  
Steady state  
33  
2.4  
°C/W  
Maximum junction-to-case (drain)  
1.9  
Notes  
a. Package limited  
b. Surface mounted on 1" x 1" FR4 board  
c. t = 10 s  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8SH is a leadless package within the PowerPAK 1212-8 package  
family. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at  
the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
f. Maximum under steady state conditions is 81 °C/W  
S18-0698-Rev. B, 09-Jul-2018  
Document Number: 79280  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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