Datasheet > SiSC06DN

SiSC06DN

更新时间： 2024-11-19 14:52:31

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	208K
描述
N-Channel 30 V (D-S) MOSFET

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SiSC06DN 数据手册

SiSC06DN

Vishay Siliconix

www.vishay.com

N-Channel 30 V (D-S) MOSFET

FEATURES

PowerPAK^®1212-8 Single

• TrenchFET^®Gen IV power MOSFET

• SkyFET^®with monolithic Schottky diode

• 100 % R_gand UIS tested

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

Top View

Bottom View

• Personal computers and servers

• Synchronous buck

PRODUCT SUMMARY

V_DS(V)

Schottky

Diode

• Synchronous rectification

• DC/DC conversion

_DS(on)max. (Ω) at V_GS= 10 V

_DS(on)max. (Ω) at V_GS= 4.5 V

0.0027

0.0040

17.5

40 ^g

Single

Q_gtyp. (nC)

_D(A)

Configuration

N-Channel MOSFET

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK 1212-8

SiSC06DN-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

+20, -16

40 ^g

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

T_C= 25 °C

_C= 70 °C

T_A= 25 °C

T_A= 70 °C

40 ^g

Continuous drain current (T_J= 150 °C)

I_D

27.6 ^{a, b}

25.2 ^{a, b}

100

40 ^g

3.3 ^{a, b}

Pulsed drain current (t = 100 μs)

I_DM

I_S

_C= 25 °C

Continuous source-drain diode current

T_A= 25 °C

Single pulse avalanche current

Single pulse avalanche energy

I_AS

L = 0.1 mH

E_AS

11.25

46.3

29.6

3.7 ^{a, b}

3.1 ^{a, b}

-55 to +150

260

_C= 25 °C

_C= 70 °C

Maximum power dissipation

P_D

T_A= 25 °C

T_A= 70 °C

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^{c, d}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^{a, e}

SYMBOL

TYPICAL

MAXIMUM

UNIT

t ≤ 10 s

Steady state

R_thJA

R_thJC

°C/W

Maximum junction-to-case (drain)

2.1

2.7

Notes

a. Surface mounted on 1" x 1" FR4 board

b. t = 10 s

c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

e. Maximum under steady state conditions is 81 °C/W

f. Based on T_C= 25 °C

g. Package limited

S21-0841-Rev. B, 09-Aug-2021

Document Number: 62944

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...9

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