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SISF00DN-T1-GE3 PDF预览

SISF00DN-T1-GE3

更新时间: 2024-11-18 22:55:11
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威世 - VISHAY /
页数 文件大小 规格书
10页 285K
描述
MOSFET DUAL N-CH 30V POWERPAK 12

SISF00DN-T1-GE3 数据手册

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SiSF00DN  
Vishay Siliconix  
www.vishay.com  
Common Drain Dual N-Channel 30 V (S1-S2) MOSFET  
FEATURES  
• TrenchFET® Gen IV power MOSFET  
PowerPAK® 1212-8SCD  
S1  
8
S1  
7
• Very low source-to-source on resistance  
S2  
6
S2  
5
• Integrated common-drain n-channel MOSFETs  
in a compact and thermally enhanced package  
S1  
S2  
• 100 % Rg and UIS tested  
• Optimizes circuit layout for bi-directional current flow  
1
G1  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
2
D1  
3
D2  
4
G2  
APPLICATIONS  
S1  
Top View  
Bottom View  
• Battery management  
G1  
• Load switching  
PRODUCT SUMMARY  
VS1S2 (V)  
N-Channel 1 MOSFET  
30  
R
S1S2(on) max. () at VGS = 10 V  
0.005  
0.007  
16.1 h  
60 a, g  
N-Channel 2 MOSFET  
G2  
RS1S2(on) max. () at VGS = 4.5 V  
Qg typ. (nC)  
IS1S2 (A)  
S2  
Configuration  
Common drain  
ORDERING INFORMATION  
Package  
PowerPAK 1212-8SCD  
SiSF00DN-T1-GE3  
Lead (Pb)-free and halogen-free  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
30  
+20 / -16  
60 a  
60 a  
25.5 b, c  
20.4 b, c  
120  
69.4  
44.4  
5.2 b, c  
3.3 b, c  
-55 to +150  
260  
UNIT  
Drain-source voltage  
Gate-source voltage  
VS1S2  
VGS  
V
TC = 25 °C  
C = 70 °C  
TA = 25 °C  
TA = 70 °C  
T
Continuous drain current (TJ = 150 °C)  
Pulsed drain current (t = 100 μs)  
Maximum power dissipation  
IS1S2  
IS1S2M  
PD  
A
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
W
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) c  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum junction-to-ambient b  
SYMBOL  
RthJA  
RthJC  
TYPICAL  
19  
MAXIMUM  
UNIT  
t 10 s  
Steady state  
24  
1.8  
°C/W  
Maximum junction-to-case (drain)  
1.4  
Notes  
a. Package limited  
b. Surface mounted on 1" x 1" FR4 board  
c. t = 10 s  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8SCD is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
f. Maximum under steady state conditions is 63 °C/W  
g. TC = 25 °C  
h. Single MOSFET  
S20-0868-Rev. B, 09-Nov-2020  
Document Number: 75573  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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