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SiSD5300DN PDF预览

SiSD5300DN

更新时间: 2024-11-22 14:55:59
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
7页 191K
描述
N-Channel 30 V (D-S) MOSFET

SiSD5300DN 数据手册

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SiSD5300DN  
Vishay Siliconix  
www.vishay.com  
N-Channel 30 V (D-S) MOSFET  
FEATURES  
• TrenchFET® Gen V power MOSFET  
PowerPAK® 1212-F  
D
8
D
7
D
• Very low RDS x Qg figure-of-merit (FOM)  
D
6
G
5
• Source flip technology, enhance thermal  
performance  
• 100 % Rg and UIS tested  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
1
S
2
S
3
S
4
S
1
D
APPLICATIONS  
• DC/DC converter  
Top View  
Bottom View  
• Synchronous rectification  
• Battery management  
PRODUCT SUMMARY  
VDS (V)  
RDS(on) max. (Ω) at VGS = 10 V  
RDS(on) max. (Ω) at VGS = 4.5 V  
Qg typ. (nC)  
G
30  
0.00087  
0.00130  
27  
• Oring and load switch  
S
ID (A)  
Configuration  
198 a  
Single  
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
PowerPAK 1212-F  
Lead (Pb)-free and halogen-free  
SiSD5300DN-T1-GE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
Drain-source voltage  
Gate-source voltage  
SYMBOL  
LIMIT  
30  
+16, -12  
198  
UNIT  
VDS  
VGS  
V
T
T
C = 25 °C  
C = 70 °C  
158  
Continuous drain current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
62 b, c  
50 b, c  
500  
A
Pulsed drain current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
TA = 25 °C  
52  
4.9 b, c  
38  
72  
57  
Continuous source-drain diode current  
Single pulse avalanche current  
Single pulse avalanche energy  
IAS  
EAS  
L = 0.1 mH  
mJ  
W
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
36  
Maximum power dissipation  
PD  
5.4 b, c  
3.5 b, c  
-55 to +150  
260  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum junction-to-ambient b, f  
Maximum junction-to-case (source)  
SMYBOL  
RthJA  
RthJC  
TYPICAL  
MAXIMUM  
UNIT  
t 10 s  
Steady state  
18  
1.7  
23  
2.2  
°C/W  
Notes  
a. Based on TC = 25 °C  
b. Surface mounted on 1" x 1" FR4 board  
c. t = 10 s  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-F is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
f. Maximum under steady state conditions is 56 °C/W  
S23-0191-Rev. A, 10-Apr-2023  
Document Number: 62220  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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