SiSD5300DN
Vishay Siliconix
www.vishay.com
N-Channel 30 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen V power MOSFET
PowerPAK® 1212-F
D
8
D
7
D
• Very low RDS x Qg figure-of-merit (FOM)
D
6
G
5
• Source flip technology, enhance thermal
performance
• 100 % Rg and UIS tested
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
1
S
2
S
3
S
4
S
1
D
APPLICATIONS
• DC/DC converter
Top View
Bottom View
• Synchronous rectification
• Battery management
PRODUCT SUMMARY
VDS (V)
RDS(on) max. (Ω) at VGS = 10 V
RDS(on) max. (Ω) at VGS = 4.5 V
Qg typ. (nC)
G
30
0.00087
0.00130
27
• Oring and load switch
S
ID (A)
Configuration
198 a
Single
N-Channel MOSFET
ORDERING INFORMATION
Package
PowerPAK 1212-F
Lead (Pb)-free and halogen-free
SiSD5300DN-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
SYMBOL
LIMIT
30
+16, -12
198
UNIT
VDS
VGS
V
T
T
C = 25 °C
C = 70 °C
158
Continuous drain current (TJ = 150 °C)
ID
TA = 25 °C
TA = 70 °C
62 b, c
50 b, c
500
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
TA = 25 °C
52
4.9 b, c
38
72
57
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
L = 0.1 mH
mJ
W
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
36
Maximum power dissipation
PD
5.4 b, c
3.5 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b, f
Maximum junction-to-case (source)
SMYBOL
RthJA
RthJC
TYPICAL
MAXIMUM
UNIT
t ≤ 10 s
Steady state
18
1.7
23
2.2
°C/W
Notes
a. Based on TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-F is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 56 °C/W
S23-0191-Rev. A, 10-Apr-2023
Document Number: 62220
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000