SiSA40DN
Vishay Siliconix
www.vishay.com
N-Channel 20 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen IV power MOSFET
PowerPAK® 1212-8 Single
D
D
7
8
D
6
• Less than 1.1 m in a package footprint of
D
5
10.89 mm2
• 2.5 V rated RDS(on)
• Optimized Qg, Qgd, and Qgd/Qgs ratio reduce
switching related power loss
1
S
2
S
• 100 % Rg and UIS tested
3
S
4
G
1
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Top View
Bottom View
PRODUCT SUMMARY
VDS (V)
D
APPLICATIONS
20
• Synchronous rectification
R
R
DS(on) max. () at VGS = 10 V
DS(on) max. () at VGS = 4.5 V
0.00110
0.00145
0.00420
18.2
• Synchronous buck converter
G
RDS(on) max. () at VGS = 2.5 V
Qg typ. (nC)
• Battery management
• Load switching
162 a
N-Channel MOSFET
ID (A)
S
Configuration
Single
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK 1212-8
SiSA40DN-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
20
+12 / -8
162
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
129
Continuous drain current (TJ = 150 °C)
ID
43.7 b, c
35 b, c
150
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
47
3.3 b, c
20
20
52
Continuous source-drain diode current
TA = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
L = 0.1 mH
mJ
W
T
T
C = 25 °C
C = 70 °C
33
Maximum power dissipation
IP
TA = 25 °C
TA = 70 °C
3.7 b, c
2.4 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b
SYMBOL
RthJA
RthJF
TYPICAL
24
MAXIMUM
UNIT
t 10 s
Steady state
33
2.4
°C/W
Maximum junction-to-case (drain)
1.9
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 81 °C/W
g. TC = 25 °C
S18-0644-Rev. A, 25-Jun-2018
Document Number: 76681
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000