SiSA72ADN
Vishay Siliconix
www.vishay.com
N-Channel 40 V (D-S) MOSFET
FEATURES
PowerPAK® 1212-8 Single
• TrenchFET® Gen IV power MOSFET
• Tuned for the lowest RDS-Qoss FOM
• 100 % Rg and UIS tested
D
D
7
8
D
6
D
5
• Qgd/Qgs ratio < 1 optimizes switching
characteristics
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
1
S
2
S
3
S
4
G
1
APPLICATIONS
D
Top View
Bottom View
• Synchronous rectification
• High power density DC/DC
• DC/AC inverters
PRODUCT SUMMARY
VDS (V)
40
0.00342
0.00466
14.8
RDS(on) max. () at VGS = 10 V
G
RDS(on) max. () at VGS = 4.5 V
Qg typ. (nC)
• Battery and load switch
ID (A)
92
N-Channel MOSFET
Configuration
Single
S
ORDERING INFORMATION
Package
PowerPAK 1212-8
Lead (Pb)-free and halogen-free
SiSA72ADN-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
40
+20, -16
92
V
TC = 25 °C
C = 70 °C
TA = 25 °C
TA = 70 °C
T
74
Continuous drain current (TJ = 150 °C)
ID
24.8 b, c
19.8 b, c
150
47.2
3.3 a, b
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
Continuous source-drain diode current
TA = 25 °C
Single pulse avalanche current
Single pulse avalanche Energy
IAS
15
L = 0.1 mH
EAS
11.25
52
33.3
mJ
W
T
T
C = 25 °C
C = 70 °C
Maximum power dissipation
PD
TA = 25 °C
TA = 70 °C
3.7 a, b
2.4 a, b
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
RthJA
TYPICAL
MAXIMUM
UNIT
Maximum junction-to-ambient b, f
t 10 s
Steady state
24
33
°C/W
Maximum junction-to-case (drain)
RthJC
1.9
2.4
Notes
a. TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 81 °C/W
S20-0582-Rev. B, 03-Aug-2020
Document Number: 79409
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000