Datasheet > SISA72DN

SISA72DN

更新时间： 2024-11-19 01:18:59

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
13页	656K
描述
N-Channel 40 V (D-S) MOSFET

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SISA72DN 数据手册

SiSA72DN

Vishay Siliconix

www.vishay.com

N-Channel 40 V (D-S) MOSFET

FEATURES

• TrenchFET^®Gen IV power MOSFET

PRODUCT SUMMARY

V_DS(V)

R_DS(on)() (MAX.)

I_D(A) ^{f, g}Q_g(TYP.)

• 100 % R_gand UIS tested

0.0035 at V_GS= 10 V

0.0048 at V_GS= 4.5 V

19.5 nC

• Tuned for the lowest R_DS-Q_ossFOM

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

PowerPAK^®1212-8 Single

APPLICATIONS

• DC/DC power supplies

• Synchronous rectification

• Motor drive control

• Telecom POL and bricks

• Battery protection

Top View

Bottom View

Ordering Information: 

SiSA72DN-T1-GE3 (lead (Pb)-free and halogen-free)

N-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

Drain-Source Voltage

Gate-Source Voltage

SYMBOL

LIMIT

UNIT

V_DS

V_GS

+20, -16

60 ^g

24.2 ^{a, b}

19.5 ^{a, b}

150

T_C= 25 °C

_C= 70 °C

Continuous Drain Current (T_J= 150 °C)

I_D

T_A= 25 °C

T_A= 70 °C

Pulsed Drain Current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

47.2

3.3 ^{a, b}

Continuous Source-Drain Diode Current

T_A= 25 °C

L = 0.1 mH

T_C= 25 °C

Single Pulse Avalanche Current

Single Pulse Avalanche Energy

I_AS

E_AS

33.3

3.7 ^{a, b}

2.4 ^{a, b}

-55 to 150

260

T_C= 70 °C

Maximum Power Dissipation

P_D

T_A= 25 °C

T_A= 70 °C

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature) ^{c, d}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum Junction-to-Ambient ^{a, e}

Maximum Junction-to-Case (Drain)

SYMBOL

R_thJA

R_thJC

TYPICAL

MAXIMUM

UNIT

t  10 s

Steady State

2.4

°C/W

1.9

Notes

a. Surface mounted on 1" x 1" FR4 board.

b. t = 10 s.

c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

e. Maximum under steady state conditions is 81 °C/W.

f. Based on T_C= 25 °C.

g. Package limited.

S16-1125-Rev. A, 06-Jun-16

Document Number: 75680

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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