Datasheet > SiSA35DN

SiSA35DN

更新时间： 2024-11-19 14:54:19

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	240K
描述
P-Channel 30 V (D-S) MOSFET

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SiSA35DN 数据手册

SiSA35DN

Vishay Siliconix

www.vishay.com

P-Channel 30 V (D-S) MOSFET

FEATURES

• TrenchFET^®Gen III p-channel power MOSFET

PowerPAK^®1212-8 Single

• 100 % R_gtested

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

• Adapter switch

• Load switch

Top View

Bottom View

PRODUCT SUMMARY

V_DS(V)

• DC/DC converters

-30

0.019

0.030

13.5

• High speed switching

_DS(on)max. () at V_GS= -10 V

_DS(on)max. () at V_GS= -4.5 V

• Power

management

battery-operated, mobile and

wearable devices

Q_gtyp. (nC)

_D(A) ^a

Configuration

P-Channel MOSFET

-16

Single

ORDERING INFORMATION

Package

PowerPAK 1212-8

SiSA35DN-T1-GE3

Lead (Pb)-free and halogen-free

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

-30

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

_C= 25 °C

-16 ^a

-10 ^{b, c}

-8 ^{b, c}

-50

-16 ^a

-2.6 ^{b, c}

T_C= 70 °C

T_A=25 °C

T_A= 70 °C

Continuous drain current (T_J= 150 °C)

I_D

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

T_A= 70 °C

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Continuous source-drain diode current

Maximum power dissipation

P_D

3.2 ^{b, c}

2.1 ^{b, c}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^{e, f}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^{b, d}

SYMBOL

R_thJA

TYPICAL

MAXIMUM

UNIT

t  10 s

Steady state

°C/W

Maximum junction-to-case (drain)

Notes

R_thJC

4.2

5.2

a. Package limited, T_C= 25 °

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. Maximum under steady state conditions is 81 °C/W

e. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

S19-0901-Rev. A, 28-Oct-2019

Document Number: 75831

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...9

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