Datasheet > SiSA26DN

SiSA26DN

更新时间： 2024-11-19 14:53:23

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	262K
描述
N-Channel 25 V (D-S) MOSFET

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SiSA26DN 数据手册

SiSA26DN

Vishay Siliconix

www.vishay.com

N-Channel 25 V (D-S) MOSFET

FEATURES

• TrenchFET^®Gen IV power MOSFET

PowerPAK^®1212-8 Single

• Optimized Q_g, Q_gd, and Q_gd/Q_gsratio reduces

switching related power loss

• 100 % R_gand UIS tested

• Material categorization: for definitions of

compliance please see www.vishay.com/doc?99912

APPLICATIONS

• Synchronous rectification

• High power density DC/DC

Top View

Bottom View

PRODUCT SUMMARY

V_DS(V)

R_DS(on)max. () at V_GS= 10 V

• Synchronous buck converter

• Load switching

0.00265

0.00390

13.2

R_DS(on)max. () at V_GS= 4.5 V

Q_gtyp. (nC)

I_D(A)

60 ^{a, g}

N-Channel MOSFET

Configuration

Single

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK 1212-8 Single

SiSA26DN-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

+16 / -12

60 ^a

29.1 ^{b, c}

23.3 ^{b, c}

150

35.4

3.2 ^{b, c}

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Continuous drain current (T_J= 150 °C)

I_D

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

T_A= 25 °C

Continuous source-drain diode current

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

31.2

L = 0.1 mH

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Maximum power dissipation

I_P

3.6 ^{b, c}

2.3 ^{b, c}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^c

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^b

SYMBOL

R_thJA

R_thJF

TYPICAL

MAXIMUM

UNIT

t  10 s

Steady state

3.2

°C/W

Maximum junction-to-case (drain)

2.5

Notes

a. Package limited.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 10 s.

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 81 °C/W.

g. T_C= 25 °C.

S17-0340-Rev. A, 06-Mar-17

Document Number: 67904

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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