SiSA01DN
Vishay Siliconix
www.vishay.com
P-Channel 30 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen IV p-channel power MOSFET
PowerPAK® 1212-8 Single
D
D
7
8
D
6
• Provides exceptionally low RDS(ON) in a compact
package that is thermally enhanced
D
5
• Enables higher power density
• 100 % Rg and UIS tested
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
1
S
2
S
3
S
4
G
1
APPLICATIONS
S
Top View
Bottom View
• Battery management in mobile devices
PRODUCT SUMMARY
VDS (V)
RDS(on) max. () at VGS = 10 V
• Adapter and charger switch
G
-30
0.0049
0.0082
27
• Battery switch
• Load switch
RDS(on) max. () at VGS = 4.5 V
Qg typ. (nC)
ID (A)
D
60 a, g
P-Channel MOSFET
Configuration
Single
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK 1212-8
SiSA01DN-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
-30
+16 / -20
-60 a
-60 a
-22.4 b, c
18.4 b, c
-150
-47.2
-3.3 b, c
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous drain current (TJ = 150 °C)
ID
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
TA = 25 °C
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
-25
31.2
52
33
L = 0.1 mH
mJ
W
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Maximum power dissipation
IP
3.7 b, c
2.4 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b
SYMBOL
RthJA
RthJF
TYPICAL
24
MAXIMUM
UNIT
t 10 s
Steady state
33
2.4
°C/W
Maximum junction-to-case (drain)
1.9
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 81 °C/W
g. TC = 25 °C
S17-1370-Rev. A, 04-Sep-17
Document Number: 76198
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000