SiS4608DN
Vishay Siliconix
www.vishay.com
N-Channel 60 V (D-S) MOSFET
FEATURES
PowerPAK® 1212-8 Single
• TrenchFET® Gen IV power MOSFET
• Very low RDS x Qg figure-of-merit (FOM)
• Tuned for the lowest RDS x Qoss FOM
• 100 % Rg and UIS tested
D
D
7
8
D
6
D
5
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
1
S
2
S
3
S
APPLICATIONS
D
4
G
1
• Synchronous rectification
• Primary side switch
Top View
Bottom View
PRODUCT SUMMARY
• DC/DC converter
G
VDS (V)
R
60
• Motor drive switch
• Circuit protection
DS(on) max. (Ω) at VGS = 10 V
DS(on) max. (Ω) at VGS = 7.5 V
Qg typ. (nC)
D (A)
Configuration
0.0118
0.0150
8.9
R
S
• Load switch
I
35.7
N-Channel MOSFET
Single
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK 1212-8
SiS4608DN-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
60
20
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
35.7
28.6
12.4 b, c
9.9 b, c
100
Continuous drain current (TJ = 150 °C)
ID
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
TA = 25 °C
24.7
3.0 b, c
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
15
11.25
27.1
L = 0.1 mH
mJ
W
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
17.4
Maximum power dissipation
PD
3.3 b, c
2.1 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b
SYMBOL
RthJA
RthJC
TYPICAL
29
MAXIMUM
UNIT
t ≤ 10 s
Steady state
38
4.6
°C/W
Maximum junction-to-case (drain)
3.7
Notes
a. TC = 25°C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 81 °C/W
S22-0059-Rev. A, 24-Jan-2022
Document Number: 62014
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000