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SiS488DN PDF预览

SiS488DN

更新时间: 2024-10-15 14:55:39
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 559K
描述
N-Channel 40 V (D-S) MOSFET

SiS488DN 数据手册

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SiS488DN  
Vishay Siliconix  
N-Channel 40 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
TrenchFET® Power MOSFET  
VDS (V)  
RDS(on) () (Max.)  
0.0055 at VGS = 10 V  
0.0075 at VGS = 4.5 V  
ID (A)f  
40g  
40g  
Qg (Typ.)  
100 % Rg and UIS Tested  
Capable of Operating with 5 V Gate Drive  
Material categorization:  
40  
9.8 nC  
For definitions of compliance please see  
www.vishay.com/doc?99912  
PowerPAK® 1212-8  
APPLICATIONS  
Synchronous Rectification  
Synchronous Buck Converters  
ORing  
Load Switching  
Motor Drive Switch  
D
S
3.30 mm  
3.30 mm  
1
S
2
S
3
G
4
D
8
G
D
7
D
6
D
5
Bottom View  
S
Ordering Information:  
SiS488DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
40  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
40g  
40g  
19.3a, b  
15.5a, b  
100  
40g  
3.1a, b  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
Pulsed Drain Current (t = 100 µs)  
IDM  
IS  
T
C = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
IAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
20  
L = 0.1 mH  
EAS  
mJ  
W
20  
T
T
C = 25 °C  
C = 70 °C  
52  
33  
Maximum Power Dissipation  
PD  
3.7a, b  
2.4a, b  
- 55 to 150  
260  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)c, d  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambienta, e  
Symbol  
Typical  
26  
Maximum  
Unit  
t 10 s  
Steady State  
RthJA  
RthJC  
33  
°C/W  
Maximum Junction-to-Case (Drain)  
1.9  
2.4  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
e. Maximum under steady state conditions is 81 °C/W.  
f. Based on TC = 25 °C.  
g. Package limited.  
Document Number: 62882  
S13-1670-Rev. A, 29-Jul-13  
For technical questions, contact: pmostechsupport@vishay.com  
This document is subject to change without notice.  
www.vishay.com  
1
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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