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SIS782DN-T1-GE3 PDF预览

SIS782DN-T1-GE3

更新时间: 2024-10-14 09:25:03
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威世 - VISHAY 晶体肖特基二极管晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
14页 568K
描述
N-Channel 30 V (D-S) MOSFET with Schottky Diode

SIS782DN-T1-GE3 技术参数

生命周期:Active包装说明:SMALL OUTLINE, S-XDSO-C5
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.74
Is Samacsys:N雪崩能效等级(Eas):11.25 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):16 A
最大漏极电流 (ID):16 A最大漏源导通电阻:0.0095 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-XDSO-C5
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):41 W
最大脉冲漏极电流 (IDM):50 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SIS782DN-T1-GE3 数据手册

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SiS782DN  
Vishay Siliconix  
N-Channel 30 V (D-S) MOSFET with Schottky Diode  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
Definition  
VDS (V)  
RDS(on) ()  
Qg (Typ.)  
I
D (A)e  
16  
SkyFET® Monolithic TrenchFET® Power MOSFET  
and Schottky Diode  
0.0095 at VGS = 10 V  
0.0120 at VGS = 4.5 V  
30  
9.5 nC  
16  
Low Thermal Resistance PowerPAK® Package  
with Small Size and Low 1.07 mm Profile  
100 % Rg and UIS Tested  
PowerPAK 1212-8  
Compliant to RoHS Directive 2002/95/EC  
S
3.30 mm  
3.30 mm  
APPLICATIONS  
1
S
2
Notebook PC  
S
3
- System Power, Memory  
G
4
Buck Converter  
Synchronous Rectifier Switch  
D
8
D
7
D
D
S
6
D
5
Bottom View  
Ordering Information:  
Schottky Diode  
G
SiS782DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
30  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
16e  
16e  
14.5a, b  
TC = 25 °C  
C = 70 °C  
T
Continuous Drain Current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
11.5a, b  
A
IDM  
IS  
Pulsed Drain Current (t = 300 µs)  
50  
16e  
4a, b  
TC = 25 °C  
TA = 25 °C  
Continuous Source-Drain Diode Current  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
IAS  
EAS  
15  
11.25  
41  
L = 0.1 mH  
mJ  
W
T
C = 25 °C  
TC = 70 °C  
A = 25 °C  
TA = 70 °C  
26  
PD  
Maximum Power Dissipation  
3.6a, b  
T
2.3a, b  
- 50 to 150  
260  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)c, d  
°C  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. See solder profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
e. Package limited.  
Document Number: 67954  
S11-1177-Rev. A, 13-Jun-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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