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SIS892DN PDF预览

SIS892DN

更新时间: 2024-10-15 09:25:03
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 565K
描述
N-Channel 100 V (D-S) MOSFET

SIS892DN 数据手册

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SiS892DN  
Vishay Siliconix  
N-Channel 100 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) ()  
ID (A)f  
30g  
Qg (Typ.)  
Definition  
0.029 at VGS = 10 V  
0.042 at VGS = 4.5 V  
TrenchFET® Power MOSFET  
100 % Rg Tested  
100 % UIS Tested  
100  
6.7 nC  
25  
PowerPAK 1212-8  
Compliant to RoHS Directive 2002/95/EC  
APPLICATIONS  
S
D
3.30 mm  
3.30 mm  
1
DC/DC Primary Side Switch  
Telecom/Server 48 V  
DC/DC Converter  
S
2
S
3
G
4
D
8
D
G
7
D
6
D
5
Bottom View  
Ordering Information: SiS892DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
S
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
100  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
20  
30g  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
27  
Continuous Drain Current (TJ = 150 °C)  
ID  
8.0a, b  
7.3a, b  
50  
A
Pulsed Drain Current  
IDM  
IS  
30g  
3.1a, b  
T
C = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
IAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
10  
L = 0.1 mH  
EAS  
mJ  
W
5
T
T
C = 25 °C  
C = 70 °C  
52  
43  
Maximum Power Dissipation  
PD  
3.7a, b  
3.1a, b  
- 55 to 150  
260  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)c, d  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambienta, e  
Symbol  
Typical  
26  
Maximum  
Unit  
t 10 s  
Steady State  
RthJA  
RthJC  
33  
°C/W  
Maximum Junction-to-Case (Drain)  
1.9  
2.4  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. See solder profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
e. Maximum under steady state conditions is 81 °C/W.  
f. Based on TC = 25 °C.  
g. Package limited.  
Document Number: 66590  
S10-2682-Rev. B, 22-Nov-10  
www.vishay.com  
1

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