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SIS476DN

更新时间: 2024-10-14 12:21:31
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威世 - VISHAY /
页数 文件大小 规格书
13页 579K
描述
N-Channel 30 V (D-S) MOSFET

SIS476DN 数据手册

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New Product  
SiS476DN  
Vishay Siliconix  
N-Channel 30 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω) (Max.)  
0.0025 at VGS = 10 V  
0.0035 at VGS = 4.5 V  
ID (A)f  
40g  
40g  
Qg (Typ.)  
Definition  
TrenchFET® Gen IV Power MOSFET  
100 % Rg and UIS Tested  
30  
22.5 nC  
Compliant to RoHS Directive 2002/95/EC  
PowerPAK® 1212-8  
APPLICATIONS  
D
Switch Mode Power Supplies  
Personal Computers and Servers  
Telecom Bricks  
S
3.30 mm  
3.30 mm  
1
S
2
S
3
G
4
VRM’s and POL  
G
D
8
D
7
D
6
D
5
S
Bottom View  
N-Channel MOSFET  
Ordering Information:  
SiS476DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
30  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
+ 20, - 16  
40g  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
40g  
ID  
Continuous Drain Current (TJ = 150 °C)  
28.6a, b  
26.2a, b  
80  
40g  
3.3a, b  
A
IDM  
IS  
Pulsed Drain Current (t = 300 µs)  
TC = 25 °C  
TA = 25 °C  
Continuous Source-Drain Diode Current  
IAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
20  
L = 0.1 mH  
EAS  
mJ  
W
20  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
52  
43  
PD  
Maximum Power Dissipation  
3.7a, b  
3.1a, b  
- 55 to 150  
260  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)c, d  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
RthJC  
Typical  
24  
Maximum  
Unit  
Maximum Junction-to-Ambienta, e  
Maximum Junction-to-Case (Drain)  
t 10 s  
Steady State  
33  
°C/W  
1.9  
2.4  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
e. Maximum under steady state conditions is 81 °C/W.  
f. Based on TC = 25 °C.  
g. Package limited.  
Document Number: 63583  
S11-2310-Rev. A, 21-Nov-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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