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SIS468DN

更新时间: 2024-10-14 12:22:35
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 569K
描述
N-Channel 80 V (D-S) MOSFET

SIS468DN 数据手册

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SiS468DN  
Vishay Siliconix  
N-Channel 80 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
TrenchFET® Power MOSFET  
VDS (V)  
RDS(on) () (Max.)  
0.0195 at VGS = 10 V  
0.0210 at VGS = 7.5 V  
0.0320 at VGS = 4.5 V  
ID (A)f  
30g  
30g  
Qg (Typ.)  
100 % Rg and UIS Tested  
Capable of Operating with 5 V Gate Drive  
Material categorization:  
80  
8.7 nC  
For definitions of compliance please see  
www.vishay.com/doc?99912  
28.5  
PowerPAK® 1212-8  
APPLICATIONS  
Telecom Bricks  
D
Primary side switch  
Synchronous Rectification  
S
3.30 mm  
3.30 mm  
1
S
2
S
3
G
4
G
D
8
D
7
D
6
D
5
S
Bottom View  
N-Channel MOSFET  
Ordering Information:  
SiS468DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
80  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
20  
30g  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
29.2  
9.8a, b  
7.8a, b  
60  
30g  
3.1a, b  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
Pulsed Drain Current (t = 300 µs)  
IDM  
IS  
T
C = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
L = 0.1 mH  
TC = 25 °C  
IAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
10  
EAS  
mJ  
W
5
52  
T
C = 70 °C  
A = 25 °C  
33.3  
3.7a, b  
2.4a, b  
- 55 to 150  
260  
Maximum Power Dissipation  
PD  
T
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)c, d  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambienta, e  
Symbol  
Typical  
26  
Maximum  
Unit  
t 10 s  
Steady State  
RthJA  
RthJC  
33  
°C/W  
Maximum Junction-to-Case (Drain)  
1.9  
2.4  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
e. Maximum under steady state conditions is 81 °C/W.  
f. Based on TC = 25 °C.  
g. Package limited.  
Document Number: 63750  
S12-0542-Rev. A, 12-Mar-12  
For technical support, please contact: pmostechsupport@vishay.com  
This document is subject to change without notice.  
www.vishay.com  
1
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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