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SiS472BDN

更新时间: 2024-10-15 14:55:27
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 232K
描述
N-Channel 30 V (D-S) MOSFET

SiS472BDN 数据手册

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SiS472BDN  
Vishay Siliconix  
www.vishay.com  
N-Channel 30 V (D-S) MOSFET  
FEATURES  
• TrenchFET® Gen IV power MOSFET  
PowerPAK® 1212-8 Single  
D
D
7
8
D
6
• 100 % Rg and UIS tested  
D
5
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
1
S
2
S
APPLICATIONS  
3
S
D
4
G
1
• DC/DC power supplies  
Top View  
Bottom View  
• High current power rails in computing  
• Telecom POL and bricks  
PRODUCT SUMMARY  
VDS (V)  
R
R
30  
G
• Battery protection  
DS(on) max. () at VGS = 10 V  
DS(on) max. () at VGS = 4.5 V  
0.0075  
0.0124  
6.9  
Qg typ. (nC)  
D (A) f  
Configuration  
S
I
38.3  
N-Channel MOSFET  
Single  
ORDERING INFORMATION  
Package  
PowerPAK 1212-8  
Lead (Pb)-free and halogen-free  
SiS472BDN-T1-GE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
30  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
+20, -16  
38.3  
30.6  
15.3 a, b  
12.1 a, b  
70  
TC = 25 °C  
C = 70 °C  
T
Continuous drain current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
Pulsed drain current (t = 300 μs)  
IDM  
IS  
TC = 25 °C  
18  
2.9 a, b  
10  
Continuous source-drain diode current  
TA = 25 °C  
L = 0.1 mH  
TC = 25 °C  
Single pulse avalanche current  
Single pulse avalanche energy  
IAS  
EAS  
5
19.8  
12.7  
3.2 a, b  
3 a, b  
mJ  
W
TC = 70 °C  
Maximum power dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) c, d  
TJ, Tstg  
-55 to +150  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
TYPICAL  
MAXIMUM  
UNIT  
Maximum junction-to-ambient a, e  
Maximum junction-to-case (drain)  
t 10 s  
Steady state  
RthJA  
RthJC  
31  
5
39  
6.3  
°C/W  
Notes  
a. Surface mounted on 1" x 1" FR4 board  
b. t = 10 s  
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection  
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
e. Maximum under steady state conditions is 81 °C/W  
f. Based on TC = 25 °C  
S17-1552-Rev. A, 02-Oct-17  
Document Number: 75537  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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