Datasheet > SiS4634LDN

SiS4634LDN

更新时间： 2024-10-15 14:54:11

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
7页	208K
描述
N-Channel 60 V (D-S) MOSFET

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SiS4634LDN 数据手册

SiS4634LDN

Vishay Siliconix

www.vishay.com

N-Channel 60 V (D-S) MOSFET

FEATURES

• TrenchFET^®Gen IV power MOSFET

PowerPAK^®1212-8 Single

• Fully lead (Pb)-free device

• Optimized Q_g, Q_gd, and Q_gd/Q_gsratio reduces

switching related power loss

• 100 % R_gand UIS tested

• Material categorization: for definitions of

compliance please see www.vishay.com/doc?99912

APPLICATIONS

Top View

Bottom View

• Synchronous rectification

• Load switch

PRODUCT SUMMARY

V_DS(V)

0.029

0.038

3.3

• Motor

drive control

_DS(on)max. () at V_GS= 10 V

_DS(on)max. () at V_GS= 4.5 V

Q_gtyp. (nC)

I_D(A)

Configuration

Single

N-Channel MOSFET

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK^®1212-8

SiS4634LDN-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

_C= 25 °C

8 ^a

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

8 ^a

Continuous drain current (T_J= 150 °C)

I_D

7.8 ^{b, c}

6.3 ^{b, c}

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

Continuous source-drain diode current

T_A= 25 °C

L = 0.1 mH

T_C= 25 °C

2.7 ^{b, c}

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

19.8

12.7

3.2 ^{b, c}

2.1 ^{b, c}

-55 to +150

260

T_C= 70 °C

Maximum power dissipation

P_D

T_A= 25 °C

T_A=70 °C

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^c

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

SYMBOL

TYPICAL

MAXIMUM

UNIT

Maximum junction-to-ambient ^{b, e}

Maximum junction-to-foot (drain)

 10 s

Steady state

R_thJA

R_thJF

6.3

°C/W

Notes

a. Package limited

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK^®1212-8 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 81 °C/W

S23-0156-Rev. A, 20-Mar-2023

Document Number: 62216

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7

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