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SIS456DN

更新时间: 2024-10-14 09:25:03
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 565K
描述
N-Channel 30 V (D-S) MOSFET

SIS456DN 数据手册

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SiS456DN  
Vishay Siliconix  
N-Channel 30 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)a  
35  
Qg (Typ.)  
Definition  
0.0051 at VGS = 10 V  
0.0068 at VGS = 4.5 V  
TrenchFET® Power MOSFET  
100 % Rg Tested  
30  
18.5 nC  
35  
100 % UIS Tested  
®
PowerPAK 1212-8  
Compliant to RoHS Directive 2002/95/EC  
S
APPLICATIONS  
3.30 mm  
3.30 mm  
D
1
S
DC/DC Converter  
- Notebook  
- POL  
2
S
3
G
4
D
8
D
G
7
D
6
D
5
Bottom View  
Ordering Information: SiS456DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
S
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
30  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
20  
35a  
35a  
21b, c  
17b, c  
100  
25  
T
T
C = 25 °C  
C = 70 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
Pulsed Drain Current  
Avalanche Current  
Avalanche Energy  
IDM  
IAS  
L = 0.1 mH  
EAS  
mJ  
A
31  
35a  
3.2b, c  
T
C = 25 °C  
Continuous Source-Drain Diode Current  
IS  
TA = 25 °C  
T
T
C = 25 °C  
C = 70 °C  
52  
33  
Maximum Power Dissipation  
PD  
W
3.8b, c  
2b, c  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Symbol  
Typical  
24  
Maximum  
Unit  
RthJA  
RthJC  
t 10 s  
Steady State  
33  
°C/W  
Maximum Junction-to-Case (Drain)  
1.9  
2.4  
Notes:  
a. Package Limited.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK 1212 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 81 °C/W.  
Document Number: 64739  
S10-1285-Rev. A, 31-May-10  
www.vishay.com  
1

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