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SIHF9610STRL-GE3 PDF预览

SIHF9610STRL-GE3

更新时间: 2024-11-24 15:51:15
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
10页 196K
描述
Power Field-Effect Transistor, P-Channel, Metal-oxide Semiconductor FET

SIHF9610STRL-GE3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:,
Reach Compliance Code:compliant风险等级:5.1
配置:Single最大漏极电流 (Abs) (ID):1.8 A
FET 技术:METAL-OXIDE SEMICONDUCTOR最高工作温度:150 °C
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):20 W子类别:Other Transistors
表面贴装:YES处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

SIHF9610STRL-GE3 数据手册

 浏览型号SIHF9610STRL-GE3的Datasheet PDF文件第2页浏览型号SIHF9610STRL-GE3的Datasheet PDF文件第3页浏览型号SIHF9610STRL-GE3的Datasheet PDF文件第4页浏览型号SIHF9610STRL-GE3的Datasheet PDF文件第5页浏览型号SIHF9610STRL-GE3的Datasheet PDF文件第6页浏览型号SIHF9610STRL-GE3的Datasheet PDF文件第7页 
IRF9610S, SiHF9610S  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Surface Mount  
• Available in Tape and Reel  
PRODUCT SUMMARY  
VDS (V)  
- 200  
• Dynamic dV/dt Rating  
RDS(on) ()  
VGS = - 10 V  
3
• P-Channel  
• Fast Switching  
• Ease of Paralleling  
Qg (Max.) (nC)  
Qgs (nC)  
11  
7
• Simple Drive Requirements  
• Material categorization: For definitions of  
compliance please see www.vishay.com/doc?99912  
Q
gd (nC)  
4
Configuration  
Single  
Note  
S
* Lead (Pb)-containing terminations are not RoHS-compliant.  
Exemptions may apply.  
D2PAK (TO-263)  
DESCRIPTION  
G
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
The D2PAK (TO-263) is a surface mount power package  
capable of accommodating die sizes up to HEX-4. It  
provides the highest power capability and the lowest  
possible on-resistance in any existing surface mount  
package. The D2PAK (TO-263) is suitable for high current  
applications because of its low internal connection  
resistance and can dissipate up to 2 W in a typical surface  
mount application.  
D
G
D
P-Channel MOSFET  
S
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
SiHF9610S-GE3  
SiHF9610STRR-GE3  
SiHF9610STRL-GE3  
IRF9610SPbF  
Lead (Pb)-free and Halogen-free  
Lead (Pb)-free  
SiHF9610S-E3  
IRF9610STRRPbF  
IRF9610STRLPbF  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
- 200  
V
VGS  
20  
TC = 25 °C  
C = 100 °C  
- 1.8  
Continuous Drain Current  
VGS at - 10 V  
ID  
T
- 1  
A
Pulsed Drain Currenta  
IDM  
- 7  
Linear Derating Factor  
Linear Derating Factor (PCB Mount)d  
0.16  
W/°C  
0.025  
Maximum Power Dissipation  
T
C = 25 °C  
20  
PD  
W
V/ns  
°C  
Maximum Power Dissipation (PCB Mount)d  
Peak Diode Recovery dV/dtb  
TA = 25 °C  
3
- 5  
dV/dt  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
300c  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 5).  
b. ISD - 1.8 A, dI/dt 70 A/μs, VDD VDS, TJ 150 °C.  
c. 1.6 mm from case.  
d. When mounted on 1" square PCB (FR-4 or G-10 material).  
S12-1558-Rev. D, 02-Jul-12  
Document Number: 91081  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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