SIGC07T60NC

更新时间： 2024-11-21 03:09:43

品牌	Logo	应用领域
英飞凌 - INFINEON		双极性晶体管
页数	文件大小	规格书
4页	69K
描述
IGBT Chip in NPT-technology

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SIGC07T60NC 数据手册

SIGC07T60NC

IGBT Chip in NPT-technology

FEATURES:

This chip is used for:

IGBT-Modules

600V NPT technology

100µm chip

positive temperature coefficient

easy paralleling

Applications:

drives

Chip Type

V_CE

I_Cn

Die Size

2.6 x 2.6 mm²

Package

Ordering Code

Q67050-A4134-

A001

SIGC07T60NC

600V

sawn on foil

MECHANICAL PARAMETER:

mm²

Raster size

2.6 x 2.6

6.76 / 4.3

1.11 x 1.78

0.5 x 0.7

100

Area total / active

Emitter pad size

Gate pad size

Thickness

µm

deg

Wafer size

150

Flat position

Max.possible chips per wafer

Passivation frontside

Emitter metallization

2249

Photoimide

3200 nm Al Si 1%

1400 nm Ni Ag –system

suitable for epoxy and soft solder die bonding

Collector metallization

Die bond

electrically conductive glue or solder

Wire bond

Al, £500µm

Reject Ink Dot Size

Æ 0.65mm ; max 1.2mm

store in original container, in dry nitrogen,

< 6 month at an ambient temperature of 23°C

Recommended Storage Environment

Edited by INFINEON Technologies AI PS DD HV3, L 7212-M, Edition 2, 28.11.2003

12 3 4

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