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SEMIX303GD12E4C PDF预览

SEMIX303GD12E4C

更新时间: 2024-02-13 00:33:07
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赛米控丹佛斯 - SEMIKRON 晶体晶体管功率控制双极性晶体管局域网
页数 文件大小 规格书
5页 371K
描述
Trench IGBT Modules

SEMIX303GD12E4C 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:FLANGE MOUNT, R-XUFM-X17针数:29
Reach Compliance Code:compliant风险等级:5.69
其他特性:UL RECOGNIZED外壳连接:ISOLATED
最大集电极电流 (IC):466 A集电极-发射极最大电压:1200 V
配置:3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR门极-发射极最大电压:20 V
JESD-30 代码:R-XUFM-X17元件数量:6
端子数量:17最高工作温度:175 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:NO
端子形式:UNSPECIFIED端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):648 ns
标称接通时间 (ton):273 nsVCEsat-Max:2.05 V
Base Number Matches:1

SEMIX303GD12E4C 数据手册

 浏览型号SEMIX303GD12E4C的Datasheet PDF文件第2页浏览型号SEMIX303GD12E4C的Datasheet PDF文件第3页浏览型号SEMIX303GD12E4C的Datasheet PDF文件第4页浏览型号SEMIX303GD12E4C的Datasheet PDF文件第5页 
SEMiX303GD12E4c  
Absolute Maximum Ratings  
Symbol Conditions  
Values  
Unit  
IGBT  
VCES  
1200  
466  
V
A
A
A
A
V
Tc = 25 °C  
Tc = 80 °C  
IC  
Tj = 175 °C  
359  
ICnom  
300  
ICRM  
ICRM = 3xICnom  
900  
VGES  
-20 ... 20  
SEMiX® 33c  
Trench IGBT Modules  
SEMiX303GD12E4c  
Features  
VCC = 800 V  
VGE 20 V  
VCES 1200 V  
Tj = 150 °C  
tpsc  
10  
µs  
°C  
Tj  
-40 ... 175  
Inverse diode  
Tc = 25 °C  
Tc = 80 °C  
IF  
338  
252  
A
A
Tj = 175 °C  
IFnom  
IFRM  
IFSM  
Tj  
300  
A
IFRM = 3xIFnom  
tp = 10 ms, sin 180°, Tj = 25 °C  
900  
A
1485  
A
• Homogeneous Si  
-40 ... 175  
°C  
• Trench = Trenchgate technology  
• VCE(sat) with positive temperature  
coefficient  
• High short circuit capability  
• UL recognised file no. E63532  
Module  
It(RMS)  
Tstg  
600  
-40 ... 125  
4000  
A
°C  
V
Visol  
AC sinus 50Hz, t = 1 min  
Typical Applications*  
• AC inverter drives  
• UPS  
• Electronic Welding  
Characteristics  
Symbol Conditions  
IGBT  
min.  
typ.  
max.  
Unit  
Remarks  
• Case temperature limited to TC=125°C  
max.  
IC = 100 A  
VCE(sat)  
Tj = 25 °C  
1.8  
2.2  
2.05  
2.4  
V
V
V
GE = 15 V  
Tj = 150 °C  
chiplevel  
• Product reliability results are valid for  
Tj=150°C  
Tj = 25 °C  
Tj = 150 °C  
Tj = 25 °C  
Tj = 150 °C  
VCE0  
rCE  
0.8  
0.7  
3.3  
5.0  
5.8  
0.1  
0.9  
0.8  
3.8  
5.3  
6.5  
0.3  
V
V
mΩ  
mΩ  
V
VGE = 15 V  
VGE(th)  
ICES  
VGE=VCE, IC = 11.4 mA  
Tj = 25 °C  
5
mA  
mA  
nF  
nF  
nF  
nC  
VGE = 0 V  
CE = 1200 V  
V
Tj = 150 °C  
f = 1 MHz  
f = 1 MHz  
f = 1 MHz  
Cies  
Coes  
Cres  
QG  
18.5  
1.22  
1.03  
1695  
2.50  
213  
VCE = 25 V  
GE = 0 V  
V
VGE = - 8 V...+ 15 V  
Tj = 25 °C  
RGint  
td(on)  
tr  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
ns  
VCC = 600 V  
IC = 300 A  
60  
ns  
Eon  
td(off)  
tf  
29.4  
535  
mJ  
ns  
RG on = 1.8 Ω  
R
G off = 1.8 Ω  
113  
ns  
di/dton = 4840 A/µs  
di/dtoff = 2980 A/µs  
Eoff  
Rth(j-c)  
41.8  
mJ  
K/W  
per IGBT  
0.095  
GD  
© by SEMIKRON  
Rev. 4 – 16.12.2009  
1

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