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RN2106MFV(TL3PAV) PDF预览

RN2106MFV(TL3PAV)

更新时间: 2024-11-15 10:10:11
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
8页 201K
描述
Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 1-Element, PNP, Silicon

RN2106MFV(TL3PAV) 数据手册

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RN2101MFVRN2106MFV  
TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) (Bias Resistor built-in Transistor)  
RN2101MFV, RN2102MFV, RN2103MFV  
RN2104MFV, RN2105MFV, RN2106MFV  
Unit: mm  
Switching, Inverter Circuit, Interface Circuit and  
Driver Circuit Applications  
1.2 ± 0.05  
0.80 ± 0.05  
z Ultra-small package, suited to very high density mounting  
z Incorporating a bias resistor into the transistor reduces the number of parts,  
1
so enabling the manufacture of ever more compact equipment and lowering  
assembly cost.  
3
z A wide range of resistor values is available for use in various circuits.  
z Complementary to the RN1101MFV to RN1106MFV  
2
Equivalent Circuit and Bias Resistor Values  
Type No.  
R1 (k)  
R2 (k)  
RN2101MFV  
RN2102MFV  
RN2103MFV  
RN2104MFV  
RN2105MFV  
RN2106MFV  
4.7  
10  
4.7  
10  
22  
47  
47  
47  
1. BASE  
22  
2. EMITTER  
3. COLLECTOR  
VESM  
47  
2.2  
4.7  
JEDEC  
JEITA  
TOSHIBA  
2-1L1A  
Weight: 1.5 mg (typ.)  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristic  
Symbol  
Rating  
Unit  
Collector-base voltage  
V
V
50  
50  
V
V
CBO  
CEO  
RN2101MFV to 2106MFV  
Collector-emitter voltage  
RN2101MFV to 2104MFV  
Emitter-base voltage  
10  
V
V
EBO  
RN2105MFV, 2106MFV  
5  
Collector current  
I
100  
150  
mA  
mW  
°C  
C
Collector power dissipation  
RN2101MFV to 2106MFV  
Junction temperature  
P (Note 1)  
C
T
150  
j
Storage temperature range  
T
stg  
55 to 150  
°C  
Note:  
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly  
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute  
maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: Mounted on an FR4 board (25.4 mm × 25.4 mm × 1.6 mm)  
Land Pattern Example  
Unit: mm  
0.5  
0.45  
1.15  
0.4  
0.45  
Start of commercial production  
2005-02  
0.4  
0.4  
1
2014-03-01  

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