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NVBG022N120M3S PDF预览

NVBG022N120M3S

更新时间: 2024-11-07 11:15:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 325K
描述
Silicon Carbide (SiC) MOSFET - EliteSiC, 22 mohm, 1200 V, M3S, D2PAK-7L

NVBG022N120M3S 数据手册

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DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
MOSFET – EliteSiC,  
22ꢀmohm, 1200ꢀV, M3S,  
D2PAK-7L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
1200 V  
30 m@ 18 V  
72 A  
Drain (TAB)  
NVBG022N120M3S  
Features  
Gate (Pin 1)  
Typ. R  
= 22 m@ V = 18 V  
GS  
DS(on)  
Ultra Low Gate Charge (Q  
= 142 nC)  
G(tot)  
Driver Source (Pin 2)  
Power Source (Pins 3, 4, 5, 6, 7)  
High Speed Switching with Low Capacitance (C = 146 pF)  
oss  
100% Avalanche Tested  
NCHANNEL MOSFET  
AECQ101 Qualified and PPAP Capable  
These Devices are RoHS Compliant  
Typical Applications  
Automotive On Board Charger  
Automotive DC/DC Converter for EV/HEV  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
1200  
Unit  
V
2
D PAK7L  
V
DSS  
CASE 418BJ  
GatetoSource Voltage  
V
10/+22  
3/+18  
V
GS  
MARKING DIAGRAM  
Recommended Operation Values  
of GatetoSource Voltage  
T
< 175°C  
= 25°C  
V
GSop  
V
C
Continuous Drain  
Current (Notes 2, 3)  
Steady  
State  
T
I
72  
234  
51  
A
W
A
C
D
BG022N  
120M3S  
AYWWZZ  
Power Dissipation  
(Note 2)  
P
D
Continuous Drain  
Current (Notes 2, 3)  
Steady  
State  
T
C
= 100°C  
I
D
BG022N120M3S = Specific Device Code  
A
Y
= Assembly Location  
= Year  
Power Dissipation  
(Note 2)  
P
117  
171  
W
A
D
WW = Work Week  
ZZ  
= Lot Traceability  
Pulsed Drain Current  
(Note 4)  
T
C
= 25°C  
I
DM  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
A
J
stg  
ORDERING INFORMATION  
+175  
Device  
Package  
Shipping  
Source Current (Body Diode)  
I
S
53  
T
C
= 25°C, V = 3 V (Note 2)  
2
GS  
NVBG022N120M3S  
D PAK7L  
800 / Tape  
& Reel  
Single Pulse DraintoSource Avalanche  
Energy (I = 23.1 A, L = 1 mH) (Note 5)  
E
AS  
267  
270  
mJ  
°C  
L(pk)  
Maximum Temperature for Soldering (10 s)  
T
L
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
2
1. Surface mounted on a FR4 board using1 in pad of 2 oz copper.  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
3. The maximium current rating is based on typical R  
performance.  
DS(on)  
4. Repetitive rating, limited by max junction temperature.  
5. E of 264 mJ is based on starting T = 25°C; L = 1 mH, I = 23.1 A,  
AS  
DD  
J
AS  
V
= 100 V, V = 18 V.  
GS  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
June, 2023 Rev. 2  
NVBG022N120M3S/D  
 

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