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NVBG025N065SC1 PDF预览

NVBG025N065SC1

更新时间: 2024-11-07 11:14:47
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 217K
描述
Silicon Carbide (SiC) MOSFET - EliteSiC, 19 mohm, 650 V, M2, D2PAK−7L

NVBG025N065SC1 数据手册

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DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
MOSFET - 19 mohm, 650ꢀV,  
M2, D2PAK-7L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
650 V  
28.5 mW @ 18 V  
106 A  
Drain (TAB)  
NVBG025N065SC1  
Features  
Typ. R  
= 19 mW @ V = 18 V  
GS  
= 25 mW @ V = 15 V  
GS  
Gate (Pin 1)  
DS(on)  
Typ. R  
DS(on)  
Ultra Low Gate Charge (Q  
= 164 nC)  
G(tot)  
Driver Source (Pin 2)  
Low Output Capacitance (C = 278 pF)  
oss  
Power Source (Pins 3, 4, 5, 6, 7)  
100% Avalanche Tested  
AECQ101 Qualified and PPAP Capable  
RoHS Compliant  
NCHANNEL MOSFET  
Typical Applications  
Automotive On Board Charger  
Automotive DC/DC Converter for EV/HEV  
D
1
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
7
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
650  
Unit  
V
D2PAK7L  
CASE 418BJ  
V
DSS  
GatetoSource Voltage  
V
8/+22  
5/+18  
V
GS  
MARKING DIAGRAM  
Recommended Operation Val-  
ues of Gate Source Voltage  
T
< 175°C  
= 25°C  
V
GSop  
V
C
BG025N  
065SC1  
AYWWZZ  
Continuous Drain  
Current (Note 2)  
Steady  
State  
T
I
106  
395  
75  
A
W
A
C
D
Power Dissipation  
(Note 2)  
P
D
BG025N065SC1 = Specific Device Code  
Continuous Drain  
Current (Notes 1, 2)  
Steady  
State  
T
C
= 100°C  
I
D
A
Y
= Assembly Location  
= Year  
Power Dissipation  
(Notes 1, 2)  
P
197  
284  
W
WW = Work Week  
D
ZZ  
= Lot Traceability  
Pulsed Drain Current (Note 3)  
T
C
= 25°C  
I
A
DM  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
J
stg  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 6 of  
this data sheet.  
+175  
Source Current (Body Diode)  
I
S
83  
62  
A
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I = 11.2 A , L = 1 mH) (Note 4)  
L
pk  
Maximum Lead Temperature for Soldering, 1/8″  
from Case for 10 Seconds  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Surface mounted on a FR4 board using1 in2 pad of 2 oz copper.  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
3. Repetitive rating, limited by max junction temperature.  
4. E of 62 mJ is based on starting T = 25°C; L = 1 mH, I = 11.2 A,  
AS  
DD  
J
AS  
V
= 50 V, V = 18 V.  
GS  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
August, 2022 Rev. 0  
NVBG025N065SC1/D  
 

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