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NTBG022N120M3S PDF预览

NTBG022N120M3S

更新时间: 2024-09-17 11:15:19
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 318K
描述
Silicon Carbide (SiC) MOSFET - EliteSiC, 22 mohm, 1200 V, M3S, D2PAK-7L

NTBG022N120M3S 数据手册

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DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
MOSFET – EliteSiC,  
22ꢀmohm, 1200ꢀV, M3S,  
D2PAK-7L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
1200 V  
30 m@ 18 V  
72 A  
Drain (TAB)  
NTBG022N120M3S  
Features  
Gate (Pin 1)  
Typ. R  
= 22 mꢀ  
Ultra Low Gate Charge (Q  
DS(on)  
= 142 nC)  
Driver Source (Pin 2)  
Power Source (Pins 3, 4, 5, 6, 7)  
G(tot)  
High Speed Switching with Low Capacitance (C = 146 pF)  
oss  
100% Avalanche Tested  
NCHANNEL MOSFET  
These Devices are RoHS Compliant  
Typical Applications  
Solar Inverters  
Electric Vehicle Charging Stations  
Uninterruptible Power Supplies (UPS)  
Energy Storage Systems  
Switch Mode Power Supplies (SMPS)  
2
D PAK7L  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
CASE 418BJ  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
1200  
Unit  
V
V
DSS  
MARKING DIAGRAM  
GatetoSource Voltage  
V
GS  
10/+22  
3/+18  
V
Recommended Operation Values  
of GatetoSource Voltage  
T <175°C  
V
GSop  
V
C
BG022N  
120M3S  
AYWWZZ  
Steady T =25°C  
State  
Continuous Drain  
Current (Notes 2, 3)  
I
D
72  
234  
51  
A
W
A
C
Power Dissipation  
P
I
D
R
(Note 2)  
BG022N120M3S = Specific Device Code  
JC  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
Steady T =100°C  
State  
Continuous Drain Cur-  
rent R (Notes 2, 3)  
C
D
JC  
Power Dissipation R  
(Note 2)  
P
D
117  
171  
W
A
JC  
ZZ  
= Lot Traceability  
Pulsed Drain Current  
(Note 4)  
T
C
= 25°C  
I
DM  
ORDERING INFORMATION  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
A
J
stg  
Device  
Package  
Shipping  
Source Current (Body Diode)  
I
S
53  
2
NTBG022N120M3S  
D PAK7L  
800 / Tape  
& Reel  
T
C
= 25°C, V = 3 V (Note 2)  
GS  
Single Pulse DraintoSource Avalanche  
Energy (I = 23.1 A, L = 1 mH) (Note 5)  
E
267  
270  
mJ  
AS  
L(pk)  
Maximum Temperature for Soldering (10 s)  
T
L
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
2
1. Surface mounted on a FR4 board using 1 in pad of 2 oz copper.  
2. The entire application environment impacts the thermal resistance values  
shown, they are not constants and are only valid for the particular conditions  
noted.  
3. The maximium current rating is based on typical R  
performance.  
DS(on)  
4. Repetitive rating, limited by max junction temperature.  
5. E of 264 mJ is based on starting T = 25°C; L = 1 mH, I = 23.1 A,  
AS  
DD  
J
AS  
V
= 100 V, V = 18 V.  
GS  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
July, 2023 Rev. 4  
NVBG022N120M3S/D  
 

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