DATA SHEET
www.onsemi.com
Silicon Carbide (SiC)
MOSFET – EliteSiC,
44ꢀmohm, 650ꢀV, M2,
D2PAK-7L
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
650 V
70 mW @ 18 V
46 A
Drain (TAB)
NTBG060N065SC1
Gate (Pin 1)
Features
• Typ. R
= 44 mW @ V = 18 V
DS(on)
DS(on)
GS
Typ. R
= 60 mW @ V = 15 V
Driver Source (Pin 2)
GS
• Ultra Low Gate Charge (Q
= 74 nC)
G(tot)
Power Source (Pins 3, 4, 5, 6, 7)
• Low Output Capacitance (C = 133 pF)
oss
N−CHANNEL MOSFET
• 100% Avalanche Tested
• T = 175°C
J
• RoHS Compliant
Typical Applications
D
• SMPS (Switching Mode Power Supplies)
• Solar Inverters
• UPS (Uninterruptable Power Supplies)
• Energy Storage
1
7
D2PAK−7L
CASE 418BJ
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
650
Unit
V
MARKING DIAGRAM
V
DSS
Gate−to−Source Voltage
V
−8/+22
−5/+18
V
GS
BG060N
065SC1
AYWWZZ
Recommended Operation Val-
ues of Gate − Source Voltage
T
< 175°C
= 25°C
V
GSop
V
C
Continuous Drain
Current (Note 2)
I
46
170
33
A
W
A
Steady
State
T
C
D
BG060N065SC1 = Specific Device Code
A
Y
= Assembly Location
= Year
WW = Work Week
Power Dissipation
(Note 2)
P
I
D
Continuous Drain
Current (Notes 1, 2)
Steady
State
T
C
= 100°C
= 25°C
D
ZZ
= Lot Traceability
Power Dissipation
(Notes 1, 2)
P
85
W
D
ORDERING INFORMATION
Pulsed Drain Current (Note 3)
T
I
130
A
C
DM
†
Device
Package
Shipping
Operating Junction and Storage Temperature
Range
T , T
−55 to
°C
J
stg
+175
NTBG060N065SC1 D2PAK−7L
800 / Tape &
Reel
Source Current (Body Diode)
I
S
46
51
A
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy (I = 10.1 A , L = 1 mH) (Note 4)
L
pk
Maximum Lead Temperature for Soldering, 1/8″
from Case for 10 Seconds
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface mounted on a FR−4 board using1 in2 pad of 2 oz copper.
2. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
3. Repetitive rating, limited by max junction temperature.
4. E of 51 mJ is based on starting T = 25°C; L = 1 mH, I = 10.1 A,
AS
DD
J
AS
V
= 50 V, V = 18 V.
GS
© Semiconductor Components Industries, LLC, 2020
1
Publication Order Number:
January, 2023 − Rev. 2
NTBG060N065SC1/D