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NTBG060N065SC1 PDF预览

NTBG060N065SC1

更新时间: 2024-11-07 11:13:11
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 305K
描述
Silicon Carbide (SiC) MOSFET - EliteSiC, 44 mohm, 650 V, M2, D2PAK-7L

NTBG060N065SC1 数据手册

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DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
MOSFET – EliteSiC,  
44ꢀmohm, 650ꢀV, M2,  
D2PAK-7L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
650 V  
70 mW @ 18 V  
46 A  
Drain (TAB)  
NTBG060N065SC1  
Gate (Pin 1)  
Features  
Typ. R  
= 44 mW @ V = 18 V  
DS(on)  
DS(on)  
GS  
Typ. R  
= 60 mW @ V = 15 V  
Driver Source (Pin 2)  
GS  
Ultra Low Gate Charge (Q  
= 74 nC)  
G(tot)  
Power Source (Pins 3, 4, 5, 6, 7)  
Low Output Capacitance (C = 133 pF)  
oss  
NCHANNEL MOSFET  
100% Avalanche Tested  
T = 175°C  
J
RoHS Compliant  
Typical Applications  
D
SMPS (Switching Mode Power Supplies)  
Solar Inverters  
UPS (Uninterruptable Power Supplies)  
Energy Storage  
1
7
D2PAK7L  
CASE 418BJ  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
650  
Unit  
V
MARKING DIAGRAM  
V
DSS  
GatetoSource Voltage  
V
8/+22  
5/+18  
V
GS  
BG060N  
065SC1  
AYWWZZ  
Recommended Operation Val-  
ues of Gate Source Voltage  
T
< 175°C  
= 25°C  
V
GSop  
V
C
Continuous Drain  
Current (Note 2)  
I
46  
170  
33  
A
W
A
Steady  
State  
T
C
D
BG060N065SC1 = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
Power Dissipation  
(Note 2)  
P
I
D
Continuous Drain  
Current (Notes 1, 2)  
Steady  
State  
T
C
= 100°C  
= 25°C  
D
ZZ  
= Lot Traceability  
Power Dissipation  
(Notes 1, 2)  
P
85  
W
D
ORDERING INFORMATION  
Pulsed Drain Current (Note 3)  
T
I
130  
A
C
DM  
Device  
Package  
Shipping  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
J
stg  
+175  
NTBG060N065SC1 D2PAK7L  
800 / Tape &  
Reel  
Source Current (Body Diode)  
I
S
46  
51  
A
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I = 10.1 A , L = 1 mH) (Note 4)  
L
pk  
Maximum Lead Temperature for Soldering, 1/8″  
from Case for 10 Seconds  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Surface mounted on a FR4 board using1 in2 pad of 2 oz copper.  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
3. Repetitive rating, limited by max junction temperature.  
4. E of 51 mJ is based on starting T = 25°C; L = 1 mH, I = 10.1 A,  
AS  
DD  
J
AS  
V
= 50 V, V = 18 V.  
GS  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
January, 2023 Rev. 2  
NTBG060N065SC1/D  
 

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