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NTBG080N120SC1 PDF预览

NTBG080N120SC1

更新时间: 2024-11-07 11:14:23
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 316K
描述
Silicon Carbide (SiC) MOSFET - EliteSiC, 40 mohm, 1200 V, M1, D2PAK-7L

NTBG080N120SC1 数据手册

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DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
MOSFET – EliteSiC,  
80ꢀmohm, 1200ꢀV, M1,  
D2PAK-7L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
1200 V  
110 mW @ 20 V  
30 A  
Drain (TAB)  
NTBG080N120SC1  
Gate (Pin 1)  
Features  
Typ. R  
= 80 mW  
Ultra Low Gate Charge (Typ. Q  
DS(on)  
Driver Source (Pin 2)  
= 56 nC)  
G(tot)  
Low Effective Output Capacitance (Typ. C = 79 pF)  
oss  
Power Source (Pins 3, 4, 5, 6, 7)  
100% Avalanche Tested  
NCHANNEL MOSFET  
T = 175°C  
J
This Device is Halide Free and RoHS Compliant with exemption 7a,  
PbFree 2LI (on second level interconnection)  
Typical Applications  
UPS  
DC-DC Converter  
Boost Inverter  
D2PAK7L  
CASE 418BJ  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
1200  
Unit  
V
MARKING DIAGRAM  
V
DSS  
GatetoSource Voltage  
V
15/+25  
5/+20  
V
GS  
AYWWZZ  
NTBG  
080120SC1  
Recommended Operation  
Values of GateSource Voltage  
T
< 175°C  
= 25°C  
V
GSop  
V
C
Continuous Drain  
Current (Note 1)  
I
30  
179  
21  
A
W
A
Steady  
State  
T
C
D
A
Y
= Assembly Location  
= Year  
WW = Work Week  
ZZ = Lot Traceability  
Power Dissipation  
(Note 1)  
P
I
D
Continuous Drain  
Current (Note 1)  
Steady  
State  
T
C
= 100°C  
= 25°C  
D
NTBG080120SC1 = Specific Device Code  
Power Dissipation  
(Note 1)  
P
89  
W
D
ORDERING INFORMATION  
Pulsed Drain Current (Note 2)  
T
I
110  
A
C
DM  
Device  
Package  
Shipping  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
NTBG080N120SC1  
D2PAK7L  
800 /  
Source Current (Body Diode)  
I
S
18  
A
Tape & Reel  
Single Pulse DraintoSource Avalanche  
E
171  
mJ  
AS  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Energy (I = 18.5 A , L = 1 mH) (Note 3)  
L
pk  
Maximum Lead Temperature for Soldering,  
1/8from Case for 10 Seconds  
T
300  
°C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Repetitive rating, limited by max junction temperature.  
3. E of 171 mJ is based on starting T = 25°C; L = 1 mH, I = 18.5 A,  
AS  
DD  
J
AS  
V
= 120 V, V = 18 V.  
GS  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
January, 2023 Rev. 4  
NTBG080N120SC1/D  
 

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