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NTBLS1D5N08MC

更新时间： 2024-09-17 11:14:19
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 480K
描述
MOSFET - Power, Single, N-Channel, TOLL, 80 V, 1.53 mΩ, 298 A

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NTBLS1D5N08MC 数据手册

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MOSFET - Power, Single  
N-Channel, TOLL  
NTBLS1D5N08MC  
80 V, 1.53 mW, 298 A  
Features  
www.onsemi.com  
• Low R  
to Minimize Conduction Losses  
DS(on)  
• Low Q and Capacitance to Minimize Driver Losses  
G
• Lowers Switching Noise/EMI  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
1.53 mW @ 10 V  
3.7 mW @ 6 V  
Compliant  
80 V  
298 A  
Applications  
• Power Tools, Battery Operated Vacuums  
• UAV/Drones, Material Handling  
• BMS/Storage, Home Automation  
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
80  
Unit  
V
G
V
DSS  
Gate−to−Source Voltage  
Continuous Drain  
V
20  
V
GS  
T
T
= 25°C  
= 25°C  
I
298  
A
C
D
S
Current R  
(Note 2)  
q
JC  
Steady  
State  
Power Dissipation  
(Note 2)  
P
250  
32  
W
A
C
D
R
q
JC  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
q
JA  
Steady  
State  
(Notes 1, 2)  
Power Dissipation  
T = 25°C  
A
P
D
2.9  
W
MO−299A  
TOLL  
R
(Notes 1, 2)  
q
JA  
CASE 100CU  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
4487  
A
A
p
Operating Junction and Storage Temperature  
Range  
T , T  
−55 to  
+150  
°C  
J
stg  
MARKING DIAGRAM  
Source Current (Body Diode)  
I
S
192  
A
Single Pulse Drain−to−Source Avalanche  
E
AS  
1441  
mJ  
Energy (I  
= 31 A, L = 3 mH)  
L(pk)  
AYWWZZ  
NTBLS  
1D5N08MC  
Lead Temperature Soldering Reflow for Solder-  
ing Purposes (1/8″ from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
NTBLS1D5N08MC = Specific Device Code  
THERMAL RESISTANCE MAXIMUM RATINGS  
A
Y
= Assembly Location  
= Year  
Parameter  
Symbol  
Value  
0.5  
Unit  
WW = Work Week  
ZZ = Lot Traceability  
Junction−to−Case − Steady State (Note 2)  
Junction−to−Ambient − Steady State (Note 2)  
R
°C/W  
q
JC  
JA  
R
43  
q
2
1. Surface−mounted on FR4 board using a 1 in pad size, 1 oz. Cu pad.  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
September, 2019 − Rev. 0  
NTBLS1D5N08MC/D  
 
1234567

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