Datasheet > NTBGS6D5N15MC

NTBGS6D5N15MC

更新时间： 2024-09-17 11:14:59

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
7页	286K
描述
Power MOSFET, 150 V, 6.5 mΩ, A, Single N−Channel, D2PAK7

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NTBGS6D5N15MC 技术参数

是否无铅：	不含铅	生命周期：	Active
包装说明：	,	Reach Compliance Code：	compliant
Factory Lead Time：	43 weeks 1 day	风险等级：	5.76
Base Number Matches：	1

NTBGS6D5N15MC 数据手册

DATA SHEET

www.onsemi.com

MOSFET - Power, Single

N-Channel, D²PAK7

150 V, 7 mW, 121 A

MAX

I MAX

(BR)DSS

DS(ON)

150 V

7 mW @ 10 V

8.7 mW @ 8 V

121 A

NTBGS6D5N15MC

D (Pin 4, TAB)

Features

• Low R

to Minimize Conduction Losses

• Low Q and Capacitance to Minimize Driver Losses

DS(on)

G (Pin 1)

• Lowers Switching Noise/EMI

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

S (Pins 2,3,5,6,7)

N−CHANNEL MOSFET

Typical Applications

MARKING

DIAGRAM

• Power Tools, Battery Operated Vacuums

• UAV/Drones, Material Handling

• BMS/Storage, Home Automation

AYWWZZ

NTBG

S6D5N15

MAXIMUM RATINGS (T = 25°C unless otherwise noted)

D PAK7

Parameter

Drain−to−Source Voltage

Symbol

Value

150

Unit

CASE 418AY

DSS

NTBGS6D5N15 = Specific Device Code

Gate−to−Source Voltage

= Assembly Location

= Year

= Work Week

Continuous Drain

Current R

Steady

State

= 25°C

121

(Note 2)

= Assembly Lot Number

Power Dissipation

238

(Note 2)

Continuous Drain

Current R

Steady

State

T = 25°C

ORDERING INFORMATION

(Notes 1, 2)

†

Device

NTBGS6D5N15MC

Package

Shipping

Power Dissipation

3.7

800 /

D PAK7

(Notes 1, 2)

Tape & Reel

(Pb−Free)

Pulsed Drain Current

T = 25°C, t = 10 ms

1800

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Operating Junction and Storage Temperature

T , T

−55 to

+175

°C

stg

Source Current (Body Diode)

198

180

Single Pulse Drain−to−Source Avalanche

Energy (I = 60 A , L = 0.1 mH)

Lead Temperature for Soldering Purposes

(1/8″ from case for 10 s)

260

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. Surface−mounted on FR4 board using a 1 in , 1 oz. Cu pad.

2. The entire application environment impacts the thermal resistance values shown,

they are not constants and are only valid for the particular conditions noted.

Publication Order Number:

February, 2022 − Rev. 1

NTBGS6D5N15MC/D

12 3 4 5 6 7

中文翻译

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