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NTBGS4D1N15MC PDF预览

NTBGS4D1N15MC

更新时间: 2024-09-17 11:14:31
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 286K
描述
Power MOSFET, 150 V, 4.1 mΩ, 185A, Single N−Channel, D2PAK7

NTBGS4D1N15MC 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET - Single N-Channel  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
4.1 mW @ 10 V  
4.7 mW @ 8 V  
150 V  
185 A  
150 V, 4.1 mW, 185 A  
NTBGS4D1N15MC  
D (Pin 4, TAB)  
Features  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
G (Pin 1)  
Lowers Switching Noise/EMI  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
S (Pins 2,3,5,6,7)  
NCHANNEL MOSFET  
Compliant  
Typical Applications  
Power Tools, Battery Operated Vacuums  
UAV/Drones, Material Handling  
BMS/Storage, Home Automation  
MARKING  
DIAGRAM  
AYWWG  
NTBG  
MAXIMUM RATINGS (T = 25C unless otherwise noted)  
J
S4D1N15  
2
Parameter  
DraintoSource Voltage  
Symbol  
Value  
150  
Unit  
V
D PAK7  
CASE 418AY  
V
DSS  
GatetoSource Voltage  
V
20  
V
GS  
A
Y
= Assembly Location  
= Year  
Continuous Drain  
Current R  
I
185  
A
D
WW = Work Week  
= PbFree Package  
q
JC  
Steady  
State  
(Note 2)  
G
T
= 25C  
C
Power Dissipation  
P
316  
20  
W
A
D
R
(Note 2)  
q
JC  
Continuous Drain  
Current R  
I
D
q
ORDERING INFORMATION  
JA  
Steady  
State  
(Notes 1, 2)  
T = 25C  
A
Device  
Package  
Shipping  
Power Dissipation  
P
3.7  
W
D
2
R
(Notes 1, 2)  
NTBGS4D1N15MC  
800 / Tape &  
Reel  
q
D PAK7  
JA  
(PbFree)  
Pulsed Drain Current  
T = 25C, t = 10 ms  
A
I
DM  
2564  
A
p
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
C  
J
stg  
+175  
Source Current (Body Diode)  
I
S
263  
332  
A
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I = 81.5 A , L = 0.1 mH)  
L
pk  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
2
1. Surfacemounted on FR4 board using a 1 in , 1 oz. Cu pad.  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
May, 2023 Rev. 2  
NTBGS4D1N15MC/D  
 

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