Datasheet (EN) 1.3
NSD8306-Q1/NSD8306A-Q1
5. Thermal Information
SYMBOL
Ta
DESCRIPTION
Ambient operating ambient temperature
Junction temperature0
MIN
-40
-40
-65
TYP
MAX
125
150
150
UNIT
°C
Tj
°C
Tstg
Rthjc
Storage temperature
°C
Thermal resistance, junction to case
2.7
62
°C/W
Thermal resistance, junction to ambient, on 2-layer
PCB
°C/W
°C/W
Rthja
Thermal resistance, junction to ambient, on 4-layer
PCB based on JEDEC standard
30
6. Electrical characteristics
Tj = -40°C to 150°C, VM=4.5V to 18V, VDD=3.0 to 5V, unless otherwise specified.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY (VM)
VM = 13.5V, EN=HIGH, all output off
VM = 13.5V, EN=HIGH, all high side on
0.5
2
5
mA
mA
VM operating supply
current
IVM
VM = 13.5V, -40≤Tj≤85°C, EN=LOW, total
current of all VM pin
IVM_SLEEP
VM sleep current
5
µA
VM falls until UVLO triggers
3.6
3.9
4.3
4.6
V
V
VM undervoltage
threshold
VUV
VM rises until operation recovers
VUV_HYS
VM undervoltage
hysteresis
400
10
mV
us
tUV
VM undervoltage
deglitch time
Guaranteed by digital scan
VM increasing, switch off, OVP_H = 0
VM decreasing, switch on, OVP_H = 0
VM increasing, switch off, OVP_H = 1
VM decreasing, switch on, OVP_H = 1
22
20
32
31
26
24
37
35
V
V
V
V
VOV
VM overvoltage
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