Datasheet > NSD914F3T5G

NSD914F3T5G

更新时间： 2024-01-26 18:52:25

品牌	Logo	应用领域
安森美 - ONSEMI		二极管开关
页数	文件大小	规格书
4页	118K
描述
High-Speed Switching Diode

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技术参数
数据手册

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NSD914F3T5G 技术参数

是否无铅：	含铅	生命周期：	Active
零件包装代码：	SOT-1123	包装说明：	LEAD FREE, SOT-1123, CASE 524AA-01, 3 PIN
针数：	3	Reach Compliance Code：	unknown
风险等级：	5.7	配置：	SINGLE
二极管元件材料：	SILICON	二极管类型：	RECTIFIER DIODE
JESD-30 代码：	R-PDSO-F3	JESD-609代码：	e3
湿度敏感等级：	NOT SPECIFIED	元件数量：	1
端子数量：	3	最大输出电流：	0.2 A
封装主体材料：	PLASTIC/EPOXY	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE	峰值回流温度（摄氏度）：	NOT SPECIFIED
最大功率耗散：	0.347 W	认证状态：	COMMERCIAL
最大重复峰值反向电压：	100 V	最大反向恢复时间：	0.004 µs
表面贴装：	YES	端子面层：	TIN
端子形式：	FLAT	端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED	Base Number Matches：	1

NSD914F3T5G 数据手册

NSD914F3T5G

High-Speed Switching

Diode

The NSD914F3T5G device is a spin−off of our popular SOT−23

three−leaded device. It is designed for high speed switching

applications and is housed in the SOT−1123 surface mount package.

This device is ideal for low−power surface mount applications where

board space is at a premium.

http://onsemi.com

Features

CATHODE

ANODE

• Reduces Board Space

• This is a Halide−Free Device

• This is a Pb−Free Device

NSD914F3T5G

MAXIMUM RATINGS

Rating

Symbol

Value

100

Unit

Vdc

Reverse Voltage

Forward Current

200

mAdc

SOT−1123

CASE 524AA

STYLE 2

Peak Forward Surge Current

THERMAL CHARACTERISTICS

Characteristic

500

FM(surge)

Symbol

Max

Unit

MARKING DIAGRAM

Total Device Dissipation, T = 25°C

Derate above 25°C

290

2.3

mW/°C

(Note 1)

R M

Thermal Resistance,

ꢀ

432

°C/W

Junction−to−Ambient

(Note 1)

= Device Code

= Date Code

Total Device Dissipation, T = 25°C

Derate above 25°C

347

2.8

mW/°C

(Note 2)

Thermal Resistance,

Junction−to−Ambient

360

°C/W

°C

ꢀ

(Note 2)

ORDERING INFORMATION

Thermal Resistance,

Junction−to−Lead 3

ꢁ

143

†

Device

NSD914F3T5G

Package

Shipping

(Note 2)

SOT−1123 8000/Tape & Reel

(Pb−Free)

Junction and Storage Temperature Range

T , T

−55 to

+150

stg

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

1. 100 mm 1 oz, copper traces.

2. 500 mm 1 oz, copper traces.

Semiconductor Components Industries, LLC, 2009

Publication Order Number:

January, 2009 − Rev. 0

NSD914F3/D

12 3 4

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