Document Number: MRFE6VP6300H
Rev. 1, 7/2011
Freescale Semiconductor
Technical Data
RF Power Field Effect Transistors
High Ruggedness N--Channel
MRFE6VP6300HR3
MRFE6VP6300HSR3
Enhancement--Mode Lateral MOSFETs
These high ruggedness devices are designed for use in high VSWR industrial
(including laser and plasma exciters), broadcast (analog and digital), aerospace
and radio/land mobile applications. They are unmatched input and output
designs allowing wide frequency range utilization, between 1.8 and 600 MHz.
1.8--600 MHz, 300 W, 50 V
LATERAL N--CHANNEL
BROADBAND
•
Typical Performance: VDD = 50 Volts, IDQ = 100 mA
P
(W)
f
G
(dB)
η
(%)
IRL
(dB)
out
ps
D
Signal Type
(MHz)
RF POWER MOSFETs
Pulsed (100 μsec,
300 Peak
230
26.5
74.0
-- 1 6
20% Duty Cycle)
CW
300 Avg.
130
25.0
80.0
-- 1 5
•
•
Capable of Handling a Load Mismatch of 65:1 VSWR, @ 50 Vdc, 230 MHz,
at all Phase Angles
•
300 Watts CW Output Power
•
300 Watts Pulsed Peak Power, 20% Duty Cycle, 100 μsec
CASE 465M--01, STYLE 1
N I -- 7 8 0 -- 4
Capable of 300 Watts CW Operation
MRFE6VP6300HR3
Features
•
•
•
•
•
•
•
•
•
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Unmatched Input and Output Allowing Wide Frequency Range Utilization
Device can be used Single--Ended or in a Push--Pull Configuration
Qualified Up to a Maximum of 50 VDD Operation
Characterized from 30 V to 50 V for Extended Power Range
Suitable for Linear Application with Appropriate Biasing
Integrated ESD Protection
Greater Negative Gate--Source Voltage Range for Improved Class C Operation
Characterized with Series Equivalent Large--Signal Impedance Parameters
RoHS Compliant
CASE 465H--02, STYLE 1
NI--780S--4
MRFE6VP6300HSR3
NI--780--4 in Tape and Reel. R3 Suffix = 250 Units, 56 mm Tape Width,
13 inch Reel. For R5 Tape and Reel options, see p. 14.
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NI--780S--4 in Tape and Reel. R3 Suffix = 250 Units, 32 mm Tape Width,
RF /V
RF /V
out DS
3
4
1
2
in GS
13 inch Reel. For R5 Tape and Reel options, see p. 14.
Table 1. Maximum Ratings
Rating
Drain--Source Voltage
Symbol
Value
--0.5, +130
--6.0, +10
--65 to +150
150
Unit
Vdc
Vdc
°C
RF /V
out DS
RF /V
in GS
V
DSS
Gate--Source Voltage
V
GS
Storage Temperature Range
Case Operating Temperature
T
stg
(Top View)
T
°C
C
D
Figure 1. Pin Connections
Total Device Dissipation @ T = 25°C
P
1050
5.26
W
C
Derate above 25°C
W/°C
(1,2)
Operating Junction Temperature
T
J
225
°C
Table 2. Thermal Characteristics
(2,3)
Characteristic
Symbol
Value
Unit
(4)
Thermal Resistance, Junction to Case
°C/W
Pulsed: Case Temperature 75°C, 300 W Pulsed, 100 μsec Pulse Width, 20% Duty Cycle,
50 Vdc, I = 100 mA, 230 MHz
CW: Case Temperature 87°C, 300 W CW, 50 Vdc, I
Z
R
θ
JC
0.05
0.19
θ
DQ
JC
= 1100 mA, 230 MHz
DQ
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access
MTTF calculators by product.
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
4. Same test circuit is used for both pulsed and CW.
© Freescale Semiconductor, Inc., 2010--2011. All rights reserved.
MRFE6VP6300HR3 MRFE6VP6300HSR3
RF Device Data
Freescale Semiconductor
1