生命周期: | Transferred | 包装说明: | FLATPACK, R-CDFP-F2 |
针数: | 3 | Reach Compliance Code: | unknown |
风险等级: | 5.04 | 外壳连接: | SOURCE |
配置: | SINGLE | 最小漏源击穿电压: | 65 V |
FET 技术: | METAL-OXIDE SEMICONDUCTOR | 最高频带: | L BAND |
JESD-30 代码: | R-CDFP-F2 | JESD-609代码: | e0 |
元件数量: | 1 | 端子数量: | 2 |
工作模式: | ENHANCEMENT MODE | 最高工作温度: | 200 °C |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装形状: | RECTANGULAR |
封装形式: | FLATPACK | 极性/信道类型: | N-CHANNEL |
最大功率耗散 (Abs): | 273 W | 认证状态: | Not Qualified |
子类别: | FET General Purpose Power | 表面贴装: | YES |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | FLAT |
端子位置: | DUAL | 晶体管应用: | AMPLIFIER |
晶体管元件材料: | SILICON | Base Number Matches: | 1 |
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