ꢒ ꢓꢎ ꢓ ꢀꢓ ꢔꢕ
SEMICONDUCTOR TECHNICAL DATA
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by MRF19120/D
The RF Sub–Micron MOSFET Line
ꢀ ꢁ ꢂ ꢃꢄꢅ ꢆ ꢁꢇꢅ ꢈꢉ ꢊ ꢋꢋ ꢅ ꢌꢍ ꢎꢆ ꢏꢐ ꢑ ꢇꢑ ꢍꢃ ꢆ ꢑ
N–Channel Enhancement–Mode Lateral MOSFETs
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Designed for CDMA base station applications with frequencies from 1930 to
1990 MHz. Suitable for FM, TDMA, CDMA and multicarrier amplifier applica-
tions. To be used in Class AB for PCN–PCS/cellular radio and WLL applications.
1990 MHz, 120 W, 26 V
LATERAL N–CHANNEL
RF POWER MOSFETs
• CDMA Performance @ 1990 MHz, 26 Volts
IS–97 CDMA Pilot, Sync, Paging, Traffic Codes 8 Thru 13
885 kHz — –47 dBc @ 30 kHz BW
1.25 MHz — –55 dBc @ 12.5 kHz BW
2.25 MHz — –55 dBc @ 1 MHz BW
Output Power — 15 Watts (Avg.)
Power Gain — 11.7 dB
Efficiency — 16%
• Internally Matched, Controlled Q, for Ease of Use
• High Gain, High Efficiency, High Linearity
• Integrated ESD Protection
CASE 375D–04, STYLE 1
• Designed for Maximum Gain and Insertion Phase Flatness
NI–1230
MRF19120
• Capable of Handling 10:1 VSWR, @ 26 Vdc, 1990 MHz, 120 Watts (CW)
Output Power
• S–Parameter Characterization at High Bias Levels
• Excellent Thermal Stability
• Characterized with Series Equivalent Large–Signal Impedance Parameters
CASE 375E–03, STYLE 1
NI–1230S
MRF19120S
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Vdc
Vdc
Drain–Source Voltage
Gate–Source Voltage
V
DSS
65
V
GS
–0.5, +15
Total Device Dissipation @ T = 25°C
Derate above 25°C
P
D
389
2.22
Watts
W/°C
C
Storage Temperature Range
Operating Junction Temperature
T
–65 to +150
200
°C
°C
stg
T
J
ESD PROTECTION CHARACTERISTICS
Test Conditions
Class
Human Body Model
Machine Model
1 (Minimum)
M3 (Minimum)
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case
Symbol
Max
Unit
R
0.45
°C/W
θ
JC
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
REV 5
MOTOROLA RF DEVICE DATA
MRF19120 MRF19120S
1
Motorola, Inc. 2002