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MRF19120 PDF预览

MRF19120

更新时间: 2024-11-14 22:45:59
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 晶体晶体管功率场效应晶体管射频
页数 文件大小 规格书
12页 349K
描述
RF POWER FIELD EFFECT TRANSISTORS

MRF19120 数据手册

 浏览型号MRF19120的Datasheet PDF文件第2页浏览型号MRF19120的Datasheet PDF文件第3页浏览型号MRF19120的Datasheet PDF文件第4页浏览型号MRF19120的Datasheet PDF文件第5页浏览型号MRF19120的Datasheet PDF文件第6页浏览型号MRF19120的Datasheet PDF文件第7页 
ꢒ ꢓꢎ ꢓ ꢀꢓ ꢔꢕ  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MRF19120/D  
The RF Sub–Micron MOSFET Line  
ꢀ ꢁ ꢂ ꢃꢄꢅ ꢆ ꢁꢇꢅ ꢈꢉ ꢊ ꢋꢋ ꢅ ꢌꢍ ꢎꢆ ꢏꢐ ꢑ ꢇꢑ ꢍꢃ ꢆ ꢑ  
N–Channel Enhancement–Mode Lateral MOSFETs  
Designed for CDMA base station applications with frequencies from 1930 to  
1990 MHz. Suitable for FM, TDMA, CDMA and multicarrier amplifier applica-  
tions. To be used in Class AB for PCN–PCS/cellular radio and WLL applications.  
1990 MHz, 120 W, 26 V  
LATERAL N–CHANNEL  
RF POWER MOSFETs  
CDMA Performance @ 1990 MHz, 26 Volts  
IS–97 CDMA Pilot, Sync, Paging, Traffic Codes 8 Thru 13  
885 kHz — –47 dBc @ 30 kHz BW  
1.25 MHz — –55 dBc @ 12.5 kHz BW  
2.25 MHz — –55 dBc @ 1 MHz BW  
Output Power — 15 Watts (Avg.)  
Power Gain — 11.7 dB  
Efficiency — 16%  
Internally Matched, Controlled Q, for Ease of Use  
High Gain, High Efficiency, High Linearity  
Integrated ESD Protection  
CASE 375D–04, STYLE 1  
Designed for Maximum Gain and Insertion Phase Flatness  
NI–1230  
MRF19120  
Capable of Handling 10:1 VSWR, @ 26 Vdc, 1990 MHz, 120 Watts (CW)  
Output Power  
S–Parameter Characterization at High Bias Levels  
Excellent Thermal Stability  
Characterized with Series Equivalent Large–Signal Impedance Parameters  
CASE 375E–03, STYLE 1  
NI–1230S  
MRF19120S  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
Vdc  
Vdc  
Drain–Source Voltage  
Gate–Source Voltage  
V
DSS  
65  
V
GS  
–0.5, +15  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
D
389  
2.22  
Watts  
W/°C  
C
Storage Temperature Range  
Operating Junction Temperature  
T
–65 to +150  
200  
°C  
°C  
stg  
T
J
ESD PROTECTION CHARACTERISTICS  
Test Conditions  
Class  
Human Body Model  
Machine Model  
1 (Minimum)  
M3 (Minimum)  
THERMAL CHARACTERISTICS  
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
0.45  
°C/W  
θ
JC  
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
REV 5  
Motorola, Inc. 2002  

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