MMDF2P02E
Power MOSFET
2 Amps, 25 Volts
P−Channel SO−8, Dual
These miniature surface mount MOSFETs feature ultra low R
DS(on)
and true logic level performance. They are capable of withstanding
high energy in the avalanche and commutation modes and the
drain−to−source diode has a low reverse recovery time. MiniMOSt
devices are designed for use in low voltage, high speed switching
applications where power efficiency is important. Typical applications
are dc−dc converters, and power management in portable and battery
powered products such as computers, printers, cellular and cordless
phones. They can also be used for low voltage motor controls in mass
storage products such as disk drives and tape drives. The avalanche
energy is specified to eliminate the guesswork in designs where
inductive loads are switched and offer additional safety margin against
unexpected voltage transients.
http://onsemi.com
2 AMPERES, 25 VOLTS
RDS(on) = 250 mW
P−Channel
D
G
Features
• Ultra Low R
Provides Higher Efficiency and Extends Battery Life
DS(on)
S
• Logic Level Gate Drive − Can Be Driven by Logic ICs
• Miniature SO−8 Surface Mount Package − Saves Board Space
• Diode Is Characterized for Use In Bridge Circuits
• Diode Exhibits High Speed, with Soft Recovery
MARKING
DIAGRAM
8
1
F2PO2
AYWW G
G
• I
Specified at Elevated Temperatures
SO−8, Dual
CASE 751
STYLE 11
DSS
8
• Avalanche Energy Specified
1
• Mounting Information for SO−8 Package Provided
• Pb−Free Package is Available
F2P02 = Specific Device Code
MAXIMUM RATINGS (T = 25°C unless otherwise noted) (Note 1)
J
A
Y
WW
G
= Assembly Location
= Year
Rating
Symbol
Value
25
Unit
Vdc
Vdc
Adc
= Work Week
Drain−to−Source Voltage
V
DSS
= Pb−Free Package
(Note: Microdot may be in either location)
Gate−to−Source Voltage − Continuous
V
GS
20
Drain Current − Continuous @ T = 25°C
I
I
2.5
1.7
13
A
A
D
D
Drain Current − Continuous @ T = 100°C
PIN ASSIGNMENT
Drain Current − Single Pulse (t ≤ 10 ms)
I
Apk
p
DM
Total Power Dissipation @ T = 25°C (Note
P
2.0
16
W
mW/°C
A
D
Source−1
Gate−1
Drain−1
Drain−1
Drain−2
1
2
3
4
8
7
6
5
2)
Derate above 25°C
Operating and Storage Temperature Range T , T
−55 to 150
245
°C
J
stg
Source−2
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Gate−2
Drain−2
Energy − Starting T = 25°C
J
Top View
(V = 20 Vdc, V = 10 Vdc, Peak
DD
GS
I = 7.0 Apk, L = 10 mH, R = 25 W)
L
G
ORDERING INFORMATION
Thermal Resistance, Junction−to−Ambient
(Note 2)
R
62.5
260
°C/W
°C
q
JA
†
Device
Package
Shipping
Maximum Lead Temperature for Soldering
Purposes, 0.0625″ from case for 10 sec.
T
L
MMDF2P02ER2
SO−8
2500 Tape & Reel
2500 Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Negative sign for P−Channel device omitted for clarity.
2. Mounted on 2″ square FR4 board (1″ sq. 2 oz. Cu 0.06″ thick single sided) with
one die operating, 10 sec. max.
MMDF2P02ER2G
SO−8
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
April, 2006 − Rev. 8
MMDF2P02E/D