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MMDF2P02E PDF预览

MMDF2P02E

更新时间: 2024-11-18 05:49:23
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 94K
描述
Power MOSFET 2 Amps, 25 Volts P−Channel SO−8, Dual

MMDF2P02E 数据手册

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MMDF2P02E  
Power MOSFET  
2 Amps, 25 Volts  
P−Channel SO−8, Dual  
These miniature surface mount MOSFETs feature ultra low R  
DS(on)  
and true logic level performance. They are capable of withstanding  
high energy in the avalanche and commutation modes and the  
drain−to−source diode has a low reverse recovery time. MiniMOSt  
devices are designed for use in low voltage, high speed switching  
applications where power efficiency is important. Typical applications  
are dc−dc converters, and power management in portable and battery  
powered products such as computers, printers, cellular and cordless  
phones. They can also be used for low voltage motor controls in mass  
storage products such as disk drives and tape drives. The avalanche  
energy is specified to eliminate the guesswork in designs where  
inductive loads are switched and offer additional safety margin against  
unexpected voltage transients.  
http://onsemi.com  
2 AMPERES, 25 VOLTS  
RDS(on) = 250 mW  
P−Channel  
D
G
Features  
Ultra Low R  
Provides Higher Efficiency and Extends Battery Life  
DS(on)  
S
Logic Level Gate Drive − Can Be Driven by Logic ICs  
Miniature SO−8 Surface Mount Package − Saves Board Space  
Diode Is Characterized for Use In Bridge Circuits  
Diode Exhibits High Speed, with Soft Recovery  
MARKING  
DIAGRAM  
8
1
F2PO2  
AYWW G  
G
I  
Specified at Elevated Temperatures  
SO−8, Dual  
CASE 751  
STYLE 11  
DSS  
8
Avalanche Energy Specified  
1
Mounting Information for SO−8 Package Provided  
Pb−Free Package is Available  
F2P02 = Specific Device Code  
MAXIMUM RATINGS (T = 25°C unless otherwise noted) (Note 1)  
J
A
Y
WW  
G
= Assembly Location  
= Year  
Rating  
Symbol  
Value  
25  
Unit  
Vdc  
Vdc  
Adc  
= Work Week  
Drain−to−Source Voltage  
V
DSS  
= Pb−Free Package  
(Note: Microdot may be in either location)  
Gate−to−Source Voltage − Continuous  
V
GS  
20  
Drain Current − Continuous @ T = 25°C  
I
I
2.5  
1.7  
13  
A
A
D
D
Drain Current − Continuous @ T = 100°C  
PIN ASSIGNMENT  
Drain Current − Single Pulse (t 10 ms)  
I
Apk  
p
DM  
Total Power Dissipation @ T = 25°C (Note  
P
2.0  
16  
W
mW/°C  
A
D
Source−1  
Gate−1  
Drain−1  
Drain−1  
Drain−2  
1
2
3
4
8
7
6
5
2)  
Derate above 25°C  
Operating and Storage Temperature Range T , T  
−55 to 150  
245  
°C  
J
stg  
Source−2  
Single Pulse Drain−to−Source Avalanche  
E
AS  
mJ  
Gate−2  
Drain−2  
Energy − Starting T = 25°C  
J
Top View  
(V = 20 Vdc, V = 10 Vdc, Peak  
DD  
GS  
I = 7.0 Apk, L = 10 mH, R = 25 W)  
L
G
ORDERING INFORMATION  
Thermal Resistance, Junction−to−Ambient  
(Note 2)  
R
62.5  
260  
°C/W  
°C  
q
JA  
Device  
Package  
Shipping  
Maximum Lead Temperature for Soldering  
Purposes, 0.0625from case for 10 sec.  
T
L
MMDF2P02ER2  
SO−8  
2500 Tape & Reel  
2500 Tape & Reel  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Negative sign for P−Channel device omitted for clarity.  
2. Mounted on 2square FR4 board (1sq. 2 oz. Cu 0.06thick single sided) with  
one die operating, 10 sec. max.  
MMDF2P02ER2G  
SO−8  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
April, 2006 − Rev. 8  
MMDF2P02E/D  
 

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