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MMDF2P03HD PDF预览

MMDF2P03HD

更新时间: 2024-09-09 12:05:03
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
10页 236K
描述
Power MOSFET 2 Amps, 30 Volts P−Channel SO−8, Dual

MMDF2P03HD 数据手册

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MMDF2P03HD  
Preferred Device  
Power MOSFET  
2 Amps, 30 Volts  
PChannel SO8, Dual  
These miniature surface mount MOSFETs feature ultra low R  
DS(on)  
and true logic level performance. They are capable of withstanding  
high energy in the avalanche and commutation modes and the  
draintosource diode has a very low reverse recovery time.  
MiniMOSt devices are designed for use in low voltage, high speed  
switching applications where power efficiency is important. Typical  
applications are dcdc converters, and power management in portable  
and battery powered products such as computers, printers, cellular and  
cordless phones. They can also be used for low voltage motor controls  
in mass storage products such as disk drives and tape drives. The  
avalanche energy is specified to eliminate the guesswork in designs  
where inductive loads are switched and offer additional safety margin  
against unexpected voltage transients.  
http://onsemi.com  
2 AMPERES  
30 VOLTS  
DS(on) = 200 mW  
R
PChannel  
D
Ultra Low R  
Provides Higher Efficiency and Extends Battery  
DS(on)  
G
Life  
Logic Level Gate Drive Can Be Driven by Logic ICs  
Miniature SO8 Surface Mount Package Saves Board Space  
Diode Is Characterized for Use In Bridge Circuits  
Diode Exhibits High Speed, With Soft Recovery  
S
MARKING  
DIAGRAM  
I  
Specified at Elevated Temperature  
DSS  
Avalanche Energy Specified  
Mounting Information for SO8 Package Provided  
SO8, Dual  
CASE 751  
STYLE 11  
D2P03  
LYWW  
8
MAXIMUM RATINGS (T = 25°C unless otherwise noted) (Note 1.)  
J
1
Rating  
Symbol Value  
Unit  
Vdc  
Vdc  
Vdc  
Adc  
DraintoSource Voltage  
V
30  
30  
DSS  
DGR  
L
Y
WW  
= Location Code  
= Year  
= Work Week  
DraintoGate Voltage (R = 1.0 MΩ)  
V
GS  
GatetoSource Voltage Continuous  
V
± 20  
GS  
Drain Current Continuous @ T = 25°C  
Drain Current Continuous @ T = 100°C  
Drain Current Single Pulse (t 10 μs)  
I
I
3.0  
1.9  
15  
A
D
D
A
PIN ASSIGNMENT  
I
Apk  
Watts  
°C  
p
DM  
Total Power Dissipation @ T = 25°C (Note 2.)  
P
2.0  
C
D
Source1  
Gate1  
Drain1  
Drain1  
Drain2  
1
2
3
4
8
7
6
5
Operating and Storage Temperature Range  
T , T  
55  
J
stg  
to 150  
Source2  
Single Pulse DraintoSource Avalanche  
E
324  
mJ  
AS  
Gate2  
Drain2  
Energy Starting T = 25°C  
J
(V = 30 Vdc, V = 5.0 Vdc, Peak  
Top View  
DD  
GS  
I = 6.0 Apk, L = 18 mH, R = 25 Ω)  
L
G
Thermal Resistance Junction to Ambient  
(Note 2.)  
R
62.5  
260  
°C/W  
°C  
θ
JA  
ORDERING INFORMATION  
Maximum Lead Temperature for Soldering  
Purposes, 1/8from case for 10 seconds  
T
L
Device  
Package  
Shipping  
2500 Tape & Reel  
MMDF2P03HDR2  
SO8  
1. Negative sign for PChannel device omitted for clarity.  
2. Mounted on 2square FR4 board (1sq. 2 oz. Cu 0.06thick single sided)  
with one die operating, 10 sec. max.  
Preferred devices are recommended choices for future use  
and best overall value.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
August, 2006 Rev. 8  
MMDF2P03HD/D  

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