MMDF2P03HD
Preferred Device
Power MOSFET
2 Amps, 30 Volts
P−Channel SO−8, Dual
These miniature surface mount MOSFETs feature ultra low R
DS(on)
and true logic level performance. They are capable of withstanding
high energy in the avalanche and commutation modes and the
drain−to−source diode has a very low reverse recovery time.
MiniMOSt devices are designed for use in low voltage, high speed
switching applications where power efficiency is important. Typical
applications are dc−dc converters, and power management in portable
and battery powered products such as computers, printers, cellular and
cordless phones. They can also be used for low voltage motor controls
in mass storage products such as disk drives and tape drives. The
avalanche energy is specified to eliminate the guesswork in designs
where inductive loads are switched and offer additional safety margin
against unexpected voltage transients.
http://onsemi.com
2 AMPERES
30 VOLTS
DS(on) = 200 mW
R
P−Channel
D
• Ultra Low R
Provides Higher Efficiency and Extends Battery
DS(on)
G
Life
• Logic Level Gate Drive − Can Be Driven by Logic ICs
• Miniature SO−8 Surface Mount Package − Saves Board Space
• Diode Is Characterized for Use In Bridge Circuits
• Diode Exhibits High Speed, With Soft Recovery
S
MARKING
DIAGRAM
• I
Specified at Elevated Temperature
DSS
• Avalanche Energy Specified
• Mounting Information for SO−8 Package Provided
SO−8, Dual
CASE 751
STYLE 11
D2P03
LYWW
8
MAXIMUM RATINGS (T = 25°C unless otherwise noted) (Note 1.)
J
1
Rating
Symbol Value
Unit
Vdc
Vdc
Vdc
Adc
Drain−to−Source Voltage
V
30
30
DSS
DGR
L
Y
WW
= Location Code
= Year
= Work Week
Drain−to−Gate Voltage (R = 1.0 MΩ)
V
GS
Gate−to−Source Voltage − Continuous
V
± 20
GS
Drain Current − Continuous @ T = 25°C
Drain Current − Continuous @ T = 100°C
Drain Current − Single Pulse (t ≤ 10 μs)
I
I
3.0
1.9
15
A
D
D
A
PIN ASSIGNMENT
I
Apk
Watts
°C
p
DM
Total Power Dissipation @ T = 25°C (Note 2.)
P
2.0
C
D
Source−1
Gate−1
Drain−1
Drain−1
Drain−2
1
2
3
4
8
7
6
5
Operating and Storage Temperature Range
T , T
− 55
J
stg
to 150
Source−2
Single Pulse Drain−to−Source Avalanche
E
324
mJ
AS
Gate−2
Drain−2
Energy − Starting T = 25°C
J
(V = 30 Vdc, V = 5.0 Vdc, Peak
Top View
DD
GS
I = 6.0 Apk, L = 18 mH, R = 25 Ω)
L
G
Thermal Resistance − Junction to Ambient
(Note 2.)
R
62.5
260
°C/W
°C
θ
JA
ORDERING INFORMATION
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
T
L
Device
Package
Shipping
2500 Tape & Reel
MMDF2P03HDR2
SO−8
1. Negative sign for P−Channel device omitted for clarity.
2. Mounted on 2″ square FR4 board (1″ sq. 2 oz. Cu 0.06″ thick single sided)
with one die operating, 10 sec. max.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
August, 2006 − Rev. 8
MMDF2P03HD/D