MMBT5550L, MMBT5551L
High Voltage Transistors
NPN Silicon
Features
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
www.onsemi.com
COLLECTOR
3
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
1
BASE
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
2
EMITTER
Collector−Emitter Voltage
V
CEO
V
CBO
V
EBO
Vdc
MMBT5550
MMBT5551
140
160
MARKING
DIAGRAM
3
Collector−Base Voltage
Vdc
MMBT5550
MMBT5551
160
180
1
2
x1x M G
Emitter−Base Voltage
6.0
Vdc
mAdc
V
SOT−23 (TO−236)
CASE 318
G
Collector Current − Continuous
Electrostatic Discharge
I
C
600
1
STYLE 6
ESD
Human Body Model
Machine Model
> 8000
> 400
x1x = Device Code
M1F = MMBT5550LT
G1 = MMBT5551LT
= Date Code*
THERMAL CHARACTERISTICS
Characteristic
M
Symbol
Max
Unit
G
= Pb−Free Package
(Note: Microdot may be in either location)
Total Device Dissipation FR−5 Board
P
D
(Note 1) @T = 25°C
225
1.8
mW
mW/°C
A
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
Derate Above 25°C
Thermal Resistance, Junction−to−Ambient
Total Device Dissipation Alumina
R
556
°C/W
q
JA
P
D
Substrate (Note 2) @T = 25°C
300
2.4
mW
mW/°C
ORDERING INFORMATION
A
Derate Above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature
†
Device
Package
Shipping
R
417
°C/W
°C
q
JA
MMBT5550LT1G
SOT−23
3,000 / Tape &
Reel
(Pb−Free)
T , T
−55 to +150
J
stg
MMBT5550LT3G
MMBT5551LT1G
SOT−23
(Pb−Free)
10,000 / Tape &
Reel
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 ꢀ 0.75 ꢀ 0.062 in.
SOT−23
(Pb−Free)
3,000 / Tape &
Reel
2. Alumina = 0.4 ꢀ 0.3 ꢀ 0.024 in. 99.5% alumina.
SMMBT5551LT1G SOT−23 3,000 / Tape & Reel
(Pb−Free)
MMBT5551LT3G
SOT−23
(Pb−Free)
10,000 / Tape &
Reel
SMMBT5551LT3G SOT−23
(Pb−Free)
10,000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 1994
1
Publication Order Number:
October, 2016 − Rev. 12
MMBT5550LT1/D